Multilayer ceramic electronic device and manufacturing method of the same

A manufacturing method of a multilayer ceramic electronic device, the method comprising:

• forming a ceramic multilayer chip that has an end face directed to a first direction, an active section, and a cover section, the active section having a plurality of internal electrodes stacked in a second direction orthogonal to the first direction, the plurality of internal electrodes being exposed to a side face of the ceramic multilayer chip directed to a third direction orthogonal to the first direction and the second direction, the cover section being stacked on the active section along the second direction,
• forming a first ridgeline portion adjacent to the end face connecting the circumferential faces extending in the first direction and the side face;
• forming a ceramic element body by forming a side margin section that is stacked on the side face, extends along the first direction and has a second ridgeline portion formed with a recess in between;
• firing the ceramic multilayer chip and the side margin section;
• and
• forming an external electrode including a base film covering the end face and a plated film formed on the base film,
• wherein the forming of the first ridgeline portion includes chamfering in which a radius of curvature R1 of the first ridgeline portion is larger than a radius of curvature R2 of the second ridgeline portion in a cross section including the second direction and the third direction.

A manufacturing method of a multilayer ceramic electronic device, the method comprising:

• forming a ceramic element body that has an end face directed to a first direction, an active section, a cover section, a side margin section, circumferential faces extending in the first direction, and a ridge portion connecting the circumferential faces, the active section having a plurality of internal electrodes stacked in a second direction orthogonal to the first direction, the plurality of internal electrodes being exposed to a side face of the ceramic element body directed to a third direction orthogonal to the first direction and the second direction, the cover section being stacked on the active section along the second direction, the side margin being stacked on the side face along the third direction;
• firing the ceramic element body;
• in the ridge portion, forming a first ridgeline portion that has a radius of curvature R1 in a cross section including the second direction and the third direction, and a second ridgeline portion that is formed with a recess in between and has a radius of curvature R2 in the cross section smaller than the radius of curvature R1;
• and
• forming an external electrode including a base film covering the end face and a plated film formed on the base film.