Card-shaped data carrier comprising ceramic

A card-shaped data carrier, comprising an electronic chip module with at least one chip and a contact structure, and comprising a card body with an arrangement region for receiving the chip module, the chip module being arranged in the arrangement region of the card body, and the card body having at least one first plastics layer and at least one ceramic layer, the first plastics layer being formed from a brittle plastics material to adjust a fracture behavior of the card-shaped data carrier, wherein the fracture behavior is controlled to provide a complete tear through the card body, breaking the card-shaped data carrier into two pieces.

A card-shaped data carrier, comprising an electronic chip module with at least one chip and a contact structure, and comprising a card body with an arrangement region for receiving the chip module, the chip module being arranged in the arrangement region of the card body, and the card body having at least one first plastics layer and at least one ceramic layer, the first plastics layer being formed from a brittle plastics material to adjust a fracture behavior of the card-shaped data carrier,

• wherein the card body is formed from a plurality of layers, the layer sequence comprising an outer ceramic layer, an adhesive, a first plastics layer, a second plastics layer, a further first plastics layer, a further adhesive and a further outer ceramic layer.