Methods of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, and related methods
AssigneeKulicke and Soffa Industries, Inc.
InventorsBasil Milton, Wei Qin
Life of this patent
Estimating the term…
Abstract
A method of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package is provided. The method includes the steps of: (a) providing package data for a semiconductor package, the semiconductor package including an electronic component; (b) simulating placement of the electronic component in a plurality of positions with respect to a substrate in the semiconductor package; and (c) determining, using a software tool, an effect of each of the plurality of positions of the electronic component on a plurality of wire loops included in the semiconductor package.
Claims14
A method of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package, the method comprising the steps of:
- (a) providing package data for a semiconductor package, the semiconductor package including an electronic component;
- (b) simulating placement of the electronic component in a plurality of positions with respect to a substrate in the semiconductor package;
- and
- (c) determining, using a software tool, an effect of each of the plurality of positions of the electronic component on a plurality of wire loops included in the semiconductor package.
Dependencies are inferred from the claim text.