Detection of security attacks through die-attach pad
AssigneeNuvoton Technology Corporation
InventorsYuval Kirschner, Tamir Golan
Life of this patent
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Abstract
An electronic device includes an Integrated Circuit (IC) and a package including a die-attach pad for connecting the IC. The IC includes (i) a measurement circuit configured to measure an electrical characteristic of the die-attach pad, and (ii) a security control circuit configured to initiate a responsive action responsively to detecting a deviation of the measured electrical characteristic of the die-attach pad from an initial measurement of the electrical characteristic.
Claims9
An electronic device, comprising:
- an Integrated Circuit (IC);
- a package;
- and
- a die-attach pad that connects the IC to the package,
- wherein the IC comprises:
- a measurement circuit, configured to measure a capacitance between the die-attach pad and a metal deposition layer in the IC;
- and
- a security control circuit, configured to initiate a responsive action responsively to detecting a deviation of the measured capacitance from an initial measurement of the capacitance.
An electronic device, comprising:
- an Integrated Circuit (IC);
- a package;
- and
- a die-attach pad that connects the IC to the package,
- wherein the IC comprises:
- a measurement circuit, configured to measure a resistance between at least two wires that are bonded to the die-attach pad;
- and
- a security control circuit, configured to initiate a responsive action responsively to detecting a deviation of the measured resistance from an initial measurement of the resistance.
A method for securing an electronic device that includes an Integrated Circuit (IC) and a package comprising a die-attach pad that connects the IC to the package, the method comprising:
- measuring a capacitance between the die-attach pad and a metal deposition layer in the IC;
- and
- initiating a responsive action responsively to detecting a deviation of the measured capacitance from an initial measurement of the capacitance.
Dependencies are inferred from the claim text.