Back to results
US 12,613,548 B2Granted
Composite materials for electronic device chassis and related methods
AssigneeIntel Corporation
InventorsDavid Pidwerbecki, Arvind S, Jeff Ku, Juha Tapani Paavola, Prakash Kurma Raju, Amruta Krishnakumar Ranade, Sudheera Sudhakar, Mousumi Deka, Snehal Chaudhari, Akarsha R. Kadadevaramath
Life of this patent
Estimating the term…
Abstract
Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.
Claims11
A method of forming a chassis for an electronic device, the method comprising:
- diecasting a magnesium alloy to form a workpiece;
- applying computer numerical control machining to the workpiece;
- polishing the workpiece;
- applying a chromate conversion coating to at least a portion of the workpiece;
- depositing aluminum on the workpiece over the chromate conversion coating;
- and
- anodizing the aluminum.
4 more elements
Dependencies are inferred from the claim text.