Gel dispensation apparatus including dual flow control channels and method of operating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsuan-Ting Kuo, Hsiu-Jen Lin
Life of this patent
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Abstract
A fiber array unit (FAU) may be attached to a photonic integrated circuit (PIC) die by: disposing an end surface of the FAU on a surface of the PIC die that contains, or is proximal to, end surfaces of waveguides with the PIC die; providing a gel dispensation apparatus including a first gel supply line, a vacuum line, and a second gel supply line configured to flow a fraction of the supply flow at a terminal output flow rate toward a dispensation tip; dispensing the gel around, and onto, a periphery of an interface between the end surface of FAU and the surface of the PIC die; and curing a dispensed portion of the gel around the periphery of the interface, whereby the FAU is attached to the PIC die.
Claims15
A method of attaching a fiber array unit (FAU) to a photonic integrated circuit (PIC) die, the method comprising:
- disposing an end surface of the FAU on a surface of the PIC die that contains, or is proximal to, end surfaces of waveguides with the PIC die;
- providing a gel dispensation apparatus including a first gel supply line configured to provide a supply flow of a gel at an initial gel supply rate, a vacuum line providing a controlled vacuum suction to an end portion of the first gel supply line and diverting a fraction of the supply flow to a vacuum pump at a diverted flow rate, and a second gel supply line that is connected to the end portion of the first gel supply line and is configured to flow a remainder of the supply flow at a terminal output flow rate toward a dispensation tip of the gel dispensation apparatus, wherein the terminal output flow rate is the initial gel supply rate less the diverted flow rate;
- dispensing the gel around, and onto, a periphery of an interface between the end surface of FAU and the surface of the PIC die;
- and
- curing a dispensed portion of the gel around the periphery of the interface, whereby the FAU is attached to the PIC die.
A method of attaching a fiber array unit (FAU) to a photonic integrated circuit (PIC) die, the method comprising:
- disposing an end surface of the FAU on a surface of the PIC die that contains, or is proximal to, end surfaces of waveguides within the PIC die;
- providing a gel dispensation apparatus including:
- a first gel supply line configured to provide a supply flow of a gel at an initial gel supply rate,
- a vacuum line providing controlled vacuum suction to an end portion of the first gel supply line and diverting a fraction of the supply flow to a vacuum pump at a diverted flow rate, and
- a second gel supply line connected to the end portion of the first gel supply line and configured to flow a remainder of the supply flow at a terminal output flow rate toward a dispensation tip, wherein the terminal output flow rate is the initial gel supply rate less the diverted flow rate;
- dispensing the gel in discrete droplets from the dispensation tip onto a periphery of an interface between the FAU and the PIC die;
- and
- curing a dispensed portion of the gel to attach the FAU to the PIC die.
Dependencies are inferred from the claim text.