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US 12,613,363 B2Granted
Measurement device, wearable device, and method of manufacturing measurement device
AssigneeRicoh Company, Ltd.
InventorKazuki Nagasawa
Life of this patent
Estimating the term…
Abstract
A measurement device includes a semiconductor substrate, a light-emitting element that emits light into the semiconductor substrate, a measurement portion on which the light that has passed through the semiconductor substrate is incident as incident light and that reflects at least a part of the incident light as reflected light, and a light-receiving element that receives the reflected light that has passed through the semiconductor substrate.
Claims20
A measurement device comprising:
- a semiconductor substrate;
- a light-emitting element that is disposed on the semiconductor substrate and that emits light into the semiconductor substrate, the light-emitting element including a plurality of layers;
- a measurement portion on which the light that has passed through the semiconductor substrate is incident as incident light and that reflects at least a part of the incident light as reflected light;
- and
- a light-receiving element that is disposed on a surface of the semiconductor substrate where the light-emitting element is disposed and that receives the reflected light that has passed through the semiconductor substrate, the light-receiving element including a plurality of layers,
- wherein at least some of the plurality of layers of the light-emitting element and some of the plurality of layers of the light-receiving element are made of a same material.
3 more elements
A measurement device comprising:
- a semiconductor substrate;
- a light-emitting element that is disposed on the semiconductor substrate and that emits light into the semiconductor substrate;
- a measurement portion on which the light that has passed through the semiconductor substrate is incident as incident light and that reflects at least a part of the incident light as reflected light;
- and
- a light-receiving element that is disposed on a surface of the semiconductor substrate where the light-emitting element is disposed and that receives the reflected light that has passed through the semiconductor substrate,
- wherein the light-emitting element and the light-receiving element each include a corresponding one of carrier excitation layers, the carrier excitation lavers having different film thicknesses or including different materials.
3 more elements
A method of manufacturing a measurement device, the method comprising:
- forming a light-emitting element such that light is emitted by the light-emitting element into a semiconductor substrate of the measurement device;
- forming a light-receiving element such that reflected light is received by the light-receiving element;
- and
- disposing a measurement portion on the semiconductor substrate such that the light that has passed through the semiconductor substrate is incident on the measurement portion,
- wherein:
- the reflected light being generated as a result of the light incident on the measurement portion being reflected by the measurement portion,
- the forming of the light-emitting element includes forming the light-emitting element on the semiconductor substrate, and
- the forming of the light-receiving element forms the light-receiving element on the semiconductor substrate.
5 more elements
Dependencies are inferred from the claim text.