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US 12,612,709 B2Granted
Method of inhibiting tarnish formation and corrosion
AssigneeDupont Electronic Materials International, LLC
InventorsAnne Hickey, Kristen M. Griffin
Life of this patent
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Abstract
A method of inhibiting tarnish formation of silver or silver alloy and corrosion of gold or gold alloy by applying a thin coating of bismuth on the silver, silver alloy, gold or gold alloy. The thin bismuth coating does not compromise the electrical performance of the silver, silver alloy, gold or gold alloy even after thermal aging.
Claims9
A method of electroplating bismuth comprising:
- providing a substrate comprising silver, silver alloy, gold or gold alloy;
- providing a bismuth electroplating bath comprising (i) a source of bismuth ions, and (ii) an acid, a salt of an acid or combinations thereof, wherein the bismuth electroplating bath has a pH of less than 7;
- contacting the substrate with the bismuth electroplating bath;
- applying a current to the bismuth electroplating bath and substrate;
- and electroplating bismuth on the silver, silver alloy, gold or gold alloy of the substrate to a thickness of greater than 0 to equal to or less than 20 nm.
2 more elements
Dependencies are inferred from the claim text.