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US 12,612,539 B2Granted
Radiation curable (meth)acrylic adhesive composition
AssigneeHenkel AG & Co. KGaA
InventorsBrian Deegan, David Branagan, Nigel Sweeney, Yongxia Wang
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Abstract
The present invention relates to a radiation curable (meth)acrylic adhesive composition comprising, consisting essentially of: i) a (meth)acrylated polydiene resin; ii) a multi-functional (meth)acrylic monomer component; iii) a mono-functional (meth)acrylic monomer component; and iv) a photo initiator component.
Claims13
A radiation curable (meth)acrylic adhesive composition comprising:
- i) a (meth)acrylated polydiene resin having two (meth)acryloyloxy groups grafted on the polydiene backbone via urethane groups;
- wherein the (meth)acrylated polydiene resin has a viscosity of less than 24,000 cP at 60° C. and wherein the (meth)acrylated polydiene resin is present in an amount of from 10 to 65% by weight based on the total weight of the adhesive composition;
- ii) a multi-functional (meth)acrylic monomer component present in an amount of from 0.1 to 25% by weight based on the total weight of the adhesive composition;
- iii) a mono-functional (meth)acrylic monomer component present in an amount of from 1 to 40% by weight based on the total weight of the adhesive composition;
- and
- iv) a photo initiator component.
3 more elements
Dependencies are inferred from the claim text.