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US 12,612,481 B2Granted
Thermosetting resin composition and encapsulation film using the same
AssigneeLG Chem, Ltd.
InventorsSong A Chae, Kwang Su Seo
Life of this patent
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Abstract
The present disclosure relates to a thermosetting resin composition, an encapsulation film, and an organic electronic device comprising the same, which is capable of forming a structure that can block moisture or oxygen flowing into an organic electronic device from the outside, and is intended to implement heat resistance and durability of the organic electronic device under severe conditions such as high temperatures.
Claims17
An encapsulation film, comprising:
- an encapsulation layer including an encapsulation resin containing an olefin-based resin having a thermosetting functional group,
- wherein the encapsulation layer has a concentration of chlorine ion residues of 1,000 ppm or less as measured by combustion ion chromatography (IC), and
- wherein the encapsulation layer has an elastic portion (Ep) of 46% or more as calculated by General Formula 1:
- Ep (%)=100×σ2/σ1 [General Formula 1]
- wherein, σ1 is a stress value measured 1 second after applying a strain of 30% to a specimen, wherein the specimen is prepared by laminating the encapsulation layer to a film having a size of 20 cm×30 cm and a thickness of 600 μm, and then loaded by applying a normal force of 150 gf at 85° C. thereto in a stress relaxation mode with ARES (Advanced Rheometric Expansion System) using a parallel plate in a laminated state, and wherein σ2 is a stress value measured after maintaining a state of applying the strain to the specimen for 180 seconds.
2 more elements
Dependencies are inferred from the claim text.