Dissimilar material solid-phase bonding method and dissimilar material solid-phase bonded structure

Abstract

The present invention provides dissimilar material solid-phase bonding that efficiently forms a robust bonded portion of metal materials having different compositions and/or structures. The present invention is a solid-phase bonding method in which one member is brought into contact with another member to form an interface to be bonded, and a bonding load is applied, thereby forming newly-generated surfaces of the one member and the other member at the interface to be bonded, wherein the one member and the other member are brought into contact to form the interface to be bonded, the temperature of the interface to be bonded is raised using ohmic heating by running current from the one member to the other member, the one member and the other member are combined while having different electrical resistances, the temperature (T1) of the one member and the temperature (T2) of the other member in the vicinity of the interface to be bonded are set so as to differ from one another, the one member and the other member have approximately the same strength at the temperature (T1) of the one member and the temperature (T2) of the other member, and a bonding load for which a bonding pressure corresponding to said strength is applied is set substantially perpendicular to the interface to be bonded.

Dependencies are inferred from the claim text.