US 12,610,799 B2 · Coating method for making chip, chip substrate, and chip

Abstract

This application discloses a coating method for making a chip. The method includes: fixing a substrate on a base. The substrate includes a hole. The method includes controlling an included angle between a plane on which the substrate is located and a deposition direction of a coating material to be greater than 0 degrees and less than 90 degrees. The method includes controlling the substrate to rotate with respect to an axis perpendicular to the plane on which the substrate is located. The method includes during the rotation of the substrate, controlling the coating material to enter the hole along the deposition direction such that the coating material is deposited on a sidewall of the hole.

Claims16

Dependent claims

A coating method for making a superconducting quantum chip, the method comprising:

fixing a substrate on a base, wherein the substrate is provided with a hole;
controlling an included angle between a plane on which the substrate is located and a deposition direction of a coating material to be greater than 0 degrees and less than 90 degrees;
controlling the substrate to rotate at an angular velocity ranging from 1 to 50 rpm about an axis that is perpendicular to the plane on which the substrate is located;
and
while the substrate is rotating, controlling the coating material to enter the hole along the deposition direction such that the coating material is deposited on a sidewall of the hole, wherein the coating material is a superconducting material.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/070,296Filed 28 Nov 2022 · continuation

Priority

CN 202110671013.117 Jun 2021

Published

US 2023/0099146 A130 Mar 2023

Granted

21 Apr 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification21 codes

H10W 20/023
Of interconnections within wafers or substrates: the interconnections being through-semiconductor vias
C23C 14/046
Coating on selected surface areas, e.g. using masks: coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
C23C 14/16
Metallic material, boron or silicon: on metallic substrates or on substrates of boron or silicon
C23C 14/165
On metallic substrates or on substrates of boron or silicon: by cathodic sputtering

Coating method for making chip, chip substrate, and chip

Life of this patent

Coating method for making chip, chip substrate, and chip

Life of this patent

Abstract

Claims16