Bonding systems using a predetermined tilt profile
AssigneeKulicke and Soffa Industries, Inc.
InventorMatthew Tarabulski
Life of this patent
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Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bonding tool assembly for bonding a semiconductor element to a substrate. The bonding system also includes a support structure assembly for supporting the substrate. The bonding system further includes a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween. The vacuum sensor is also used in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly.
Claims12
A bonding system for bonding a semiconductor element to a substrate, the bonding system comprising:
- (a) a bonding tool assembly for bonding a semiconductor element to a substrate;
- (b) a support structure assembly for supporting the substrate;
- (c) a vacuum sensor for sensing a vacuum leakage at an interface between the bonding tool assembly and the support structure assembly during contact therebetween in connection with a tilt adjustment between the bonding tool assembly and the support structure assembly,
- wherein the tilt adjustment between the bonding tool assembly and the support structure assembly follows a predetermined tilt profile, the predetermined tilt profile including a plurality of tilt values determined prior to the tilt adjustment, and
- wherein the vacuum sensor senses the vacuum leakage at the interface during the tilt adjustment according to the predetermined tilt profile;
- and
- (d) a computer in communication with the vacuum sensor, the computer configured to determine a desired tilt value of at least one of the bonding tool assembly and the support structure assembly using the vacuum leakage sensed by the vacuum sensor.
Dependencies are inferred from the claim text.