Thermoelectric device

A thermoelectric device comprising:

• a duct;
• a first thermoelectric module disposed on the duct and including a thermoelectric element;
• a shield member disposed on the first thermoelectric module;
• and
• a bonding layer,
• wherein the first thermoelectric module includes:
• a first substrate;
• a first electrode part disposed on the first substrate;
• a semiconductor element part disposed on the first electrode part;
• a second electrode part disposed on the semiconductor element part;
• a second substrate disposed on the second electrode part;
• and
• a first terminal electrode and a second terminal electrode that are disposed on an area of the first substrate in which the first electrode part is not disposed,
• wherein an inner surface of the shield member includes a first concave part disposed on the first terminal electrode, a second concave part disposed on the second terminal electrode, and a first protruding part protruding toward the first substrate between the first concave part and the second concave part,
• wherein the bonding layer bonds the first protruding part and the first substrate between the first terminal electrode and the second terminal electrode, and
• wherein a height of bonding layer in a direction perpendicular to the first substrate is greater than a height of the first terminal electrode or the second terminal electrode.