Method for etching film and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorsTomohiko Niizeki, Takayuki Katsunuma, Yoshihide Kihara, Maju Tomura
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AssigneeTokyo Electron Limited
InventorsTomohiko Niizeki, Takayuki Katsunuma, Yoshihide Kihara, Maju Tomura
Estimating the term…
An etching apparatus includes: a chamber; a substrate support disposed in the chamber; one or more heaters disposed in the substrate support; a gas supply; a plasma generator; a controller configured to perform an etching process comprising a plurality of cycles; and a heater controller. Each cycle includes: controlling the gas supply to supply a precursor into the chamber, thereby forming a precursor layer on a substrate supported by the substrate support, the substrate including a film and a mask; and controlling the gas supply and the plasma generator to supply a process gas into the chamber and generate a plasma from the process gas in the chamber, thereby etching the film through the mask.
An etching apparatus comprising:
An etching apparatus comprising:
Dependencies are inferred from the claim text.