Power management and delivery for high bandwidth memory

An apparatus, comprising:

• a plurality of memory dies;
• a plurality of microbumps coupled with the plurality of memory dies, the plurality of microbumps configured to provide a voltage value to the plurality of memory dies;
• and
• a heatsink assembly coupled with the plurality of memory dies, the heatsink assembly positioned above the plurality of memory dies, wherein the plurality of memory dies, the plurality of microbumps, or both, are arranged in a vertical stack, and
• wherein the apparatus is configured to provide a ground voltage to the plurality of memory dies via the heatsink assembly positioned above the plurality of memory dies.

An apparatus, comprising:

• a plurality of memory dies;
• a plurality of microbumps coupled with the plurality of memory dies, the plurality of microbumps configured for signaling to the plurality of memory dies;
• an integrated circuit coupled with the plurality of memory dies, the integrated circuit configured to control a voltage value to provide power to the plurality of memory dies,
• wherein the plurality of memory dies, the plurality of microbumps, or the integrated circuit, or a combination thereof, are arranged in a vertical stack;
• and
• a heatsink assembly coupled with the integrated circuit, wherein the apparatus is configured to provide power to the plurality of memory dies via the heatsink assembly, the heatsink assembly positioned above the integrated circuit.