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US 12,607,925 B2Granted
Pellicle, exposure original plate, exposure device, method of manufacturing pellicle, and method of manufacturing semiconductor device
AssigneeMitsui Chemicals, Inc.
InventorsYousuke Ono, Atsushi Okubo, Kazuo Kohmura
Life of this patent
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Abstract
A pellicle including: a pellicle film including a carbon-based film having a carbon content rate of 40 mass % or more; a support frame that supports the pellicle film; and an adhesive layer containing an adhesive, the pellicle having the total amount of aqueous outgas of 5.0×10−4 Pa·L/sec or less in an atmosphere of 23° C. and 1×10−3 Pa or less.
Claims10
A pellicle comprising:
- a pellicle film including a carbon-based film having a carbon content rate of 40 mass % or more;
- a support frame that supports the pellicle film;
- and
- an adhesive layer containing an adhesive, wherein the adhesive layer has a moisture content rate of 2.00 mass % or less, and wherein the adhesive is at least one selected from the group consisting of a silicone resin adhesive, an acrylic resin adhesive, a hydrogenated styrene-based adhesive, and an epoxy resin adhesive,
- the pellicle having a total amount of aqueous outgas of 5.0×10−4 Pa·L/sec or less in an atmosphere of 23° C. and 1×10−3 Pa or less.
2 more elements
A method of manufacturing a pellicle, the method comprising:
- a step of preparing a carbon-based material having a carbon content rate of 40 mass % or more;
- a step of forming a film of the carbon-based material in a sheet shape to manufacture a pellicle film;
- a step of connecting the pellicle film to a support frame so as to cover an opening of the support frame having the opening;
- and
- a step of forming an adhesive layer by applying an adhesive to a surface of the support frame in an opening on a side opposite to a side to which the pellicle film is connected,
- wherein the adhesive layer has a moisture content rate of 2.00 mass % or less, and
- wherein the adhesive is at least one selected from the group consisting of a silicone resin adhesive, an acrylic resin adhesive, a hydrogenated styrene-based adhesive, and an epoxy resin adhesive.
4 more elements
Dependencies are inferred from the claim text.