Optical waveguide edge coupling within a substrate
AssigneeIntel Corporation
InventorsDilan Seneviratne, Whitney Bryks, Ala Omer, Jieying Kong, Sarah Blythe, Bainye Francoise Angoua
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Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques directed to dense integration of PICs in a substrate using an optical fanout structure that includes waveguides formed within a substrate to optically couple with the PICs at an edge of the substrate. One or more PICs may then be electrically with dies such as processor dies or memory dies. The one or more PICs may be located within a cavity in the substrate. The substrate may be made of glass or silicon. Other embodiments may be described and/or claimed.
Claims24
An apparatus comprising:
- a substrate with a first side and a second side opposite the first side;
- an optical waveguide within the substrate, the optical waveguide between the first side and the second side of the substrate, wherein an end of the optical waveguide is at an edge of the substrate between the first side and the second side, and wherein the optical waveguide has a first thickness at the edge of the substrate, and a second thickness below the edge of the substrate, wherein the first thickness is greater than the second thickness;
- and
- an optical connector on the first side of the substrate, the optical connector vertically overlapping with the optical waveguide.
A method comprising:
- providing a first layer of a substrate;
- forming one or more optical waveguides on a surface of the first layer of the substrate, wherein an end of one of the one or more optical waveguides is at an edge of the substrate, and wherein the one of the one or more optical waveguides has a first thickness at the edge of the substrate, and a second thickness below the edge of the substrate, wherein the first thickness is greater than the second thickness;
- applying a second layer of the substrate onto the surface of the first layer of the substrate;
- and
- coupling an optical connector to the second layer of the substrate, the optical connector vertically overlapping with the optical waveguide.
A package comprising:
- a substrate comprising:
- a first side and a second side opposite the first side;
- a cavity within the substrate extending from the first side of the substrate to the second side of the substrate;
- and
- an optical waveguide within the substrate, the optical waveguide between the first side and the second side of the substrate, wherein an end of the optical waveguide is at an edge of the substrate between the first side and the second side adjacent to the cavity, and wherein the optical waveguide has a first thickness at the edge of the substrate, and a second thickness below the edge of the substrate, wherein the first thickness is greater than the second thickness;
- an optical connector on the first side of the substrate, the optical connector vertically overlapping with the optical waveguide;
- and
- a photonic integrated circuit (PIC) optically coupled with the end of the optical waveguide.
Dependencies are inferred from the claim text.