Apparatus and methods for voltage droop detection in die architectures
AssigneeQUALCOMM Incorporated
InventorsAmit Aneja, Dipti Ranjan Pal, Kiran Kumar Malipeddi
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AssigneeQUALCOMM Incorporated
InventorsAmit Aneja, Dipti Ranjan Pal, Kiran Kumar Malipeddi
Estimating the term…
Methods and apparatuses directed to. In some examples, a die package includes voltage logic that provides a voltage to a voltage rail, clock logic that generates a clock signal, and adaptive clock distribution logic that receives the clock signal and the voltage. The adaptive clock distribution logic can increment an event count when the clock signal is above a threshold frequency, or when the voltage is below a threshold voltage level. The die package also includes a processor that can monitor the event counts during operation and determine a status of the adaptive clock distribution logic based on the event counts. In some examples, the processor can test the adaptive clock distribution logic by causing the clock signal to operate above the threshold frequency, or causing the voltage logic to provide the voltage below the threshold voltage level. The processor can then read the event counts to determine the status.
A die package comprising:
A method by a processor comprising:
A non-transitory, machine-readable storage medium comprises instructions that, when executed by at least one processor, cause the at least one processor to:
An apparatus comprising:
Dependencies are inferred from the claim text.