Method and apparatus for testing a package-on-package semiconductor device

A method for testing a package-on-package semiconductor device, comprising the steps of:

• (A) controlling a pick-and-place device to load a first package device into a test socket by a main controller, wherein the main controller controls a mobile carrier to move to a position between the pick-and-place device and the test socket, controls the pick-and-place device so that the pick-and-place device is lowered to pick the first package device from the mobile carrier and then lifted, and controls the mobile carrier to move away from the position between the pick-and-place device and the test socket and controls the pick-and-place device so that the pick-and-place device is lowered to place the first package device into the test socket and then lifted;
• (B) controlling the pick-and-place device to pick an upper chip holder, in which a second package device is accommodated, by the main controller, wherein the main controller controls the mobile carrier to move to the position between the pick-and-place device and the test socket and controls the pick-and-place device so that the pick-and-place device is lowered to pick the upper chip holder from the mobile carrier and then lifted, and the main controller controls the mobile carrier to move away from the position between the pick-and-place device and the test socket;
• (C) controlling the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket by the main controller so that the second package device is electrically connected to the first package device for execution of a test of the first package device;
• (D) when the test of the first package device is completed, controlling the pick-and-place device so that the pick-and-place device is lifted together with the upper chip holder, controlling the mobile carrier to move to the position between the pick-and-place device and the test socket, controlling the pick-and-place device so that the pick-and-place device is lowered to place the upper chip holder into the mobile carrier and then lifted, and controlling the mobile carrier to move away from the position between the pick-and-place device and the test socket by the main controller;
• and
• (E) controlling the pick-and-place device so that the pick-and-place device is lowered to pick the first package device from the test socket and then lifted, controlling the mobile carrier to move to the position between the pick-and-place device and the test socket, and controlling the pick-and-place device so that the pick-and-place device is lowered to place the first package device into the mobile carrier and then lifted by the main controller.