Substrate processing apparatus, processing gas concentrating apparatus, and substrate processing method

A substrate processing apparatus comprising:

• a chamber configured to accommodate a substrate;
• a raw material tank configured to store a raw material of a processing gas for processing the substrate;
• a carrier gas supply configured to supply a carrier gas to the raw material tank;
• a mixed gas flow path connected to the raw material tank, and configured to allow a mixed gas of the processing gas obtained from the raw material of the processing gas and the carrier gas to flow therethrough;
• a concentration tank connected to a downstream of the mixed gas flow path, the concentration tank having an internal space in which a porous member is disposed, the porous member being composed of a metal-organic framework configured such that the processing gas contained in the mixed gas is preferentially adsorbed, and the metal-organic framework containing a metal complex composed of a coordinate bond between a metal ion and organic compounds, and comprising a structure in which nanometer-sized pores formed by aggregation of a plurality of metal complexes are regularly and sterically arranged;
• a mixed gas supply stop valve provided in the mixed gas flow path and configured to supply the mixed gas to the concentration tank and stop the supply;
• a desorption mechanism including a first heater and configured to desorb the processing gas adsorbed to the porous member;
• a concentration gas flow path provided between the concentration tank and the chamber, and configured to allow the processing gas desorbed from the porous member to flow to the chamber;
• a processing gas supply stop valve provided in the concentration gas flow path;
• a discharge path branched from the concentration gas flow path at an upstream side of the processing gas supply stop valve and configured to discharge the carrier gas;
• a carrier gas discharging valve provided in the discharge path;
• and
• a controller configured to control an overall operation of the substrate processing apparatus,
• wherein the controller is configured to open the mixed gas supply stop valve and the carrier gas discharging valve, close the processing gas supply stop valve, and circulate the mixed gas from the raw material tank to the concentration tank so as to adsorb the processing gas included in the mixed gas to the porous member, and
• the controller is configured to close the mixed gas supply stop valve and the carrier gas discharging valve, open the processing gas supply stop valve, and supply a concentration gas containing the processing gas to the chamber so as to adsorb the processing gas to a surface of the substrate.