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US 12,606,731 B2Granted
Resin composition and heat-dissipating member
AssigneeSekisui Chemical Co., Ltd.
InventorsMasataka Sugimoto, Osamu Inui, Izumi Matsumoto, Tetsurou Yoshioka, Abison Scaria
Life of this patent
Estimating the term…
Abstract
There is provided a resin composition containing a resin component and diamond particles, the diamond particles having the total metal content constituted from iron, nickel, cobalt, and chromium of 5 ppm or higher and 300 ppm or lower.
Claims10
A resin composition, comprising a resin component and diamond particles,
- the diamond particles having a total metal content constituted from iron, nickel, cobalt, and chromium of 15 ppm or higher and 300 ppm or lower,
- the diamond particles having a content of iron of 7 ppm or higher and 50 ppm or lower, and
- the diamond particles having a content of nickel of 3.5 ppm or higher and 25 ppm or lower.
Dependencies are inferred from the claim text.