Thermosetting resin composition, semiconductor device and electrical/electronic component

A thermosetting resin composition comprising:

• (A) silver fine particles;
• (B) a silver powder other than the silver fine particles (A), the silver powder having an average particle size of more than 0.2 pm and 30 μm or less;
• (D) a liquid thermosetting resin;
• (E) a flux;
• and
• (F) a solvent,
• wherein the silver fine particles (A) include plate-shaped silver fine particles (A1) having a uniform thickness,
• wherein the plate-shaped silver fine particles (A1) are obtained through growth of one metal crystal plane and their upper surfaces are covered with [111] planes,
• wherein a longer side in a perpendicular direction to a thickness direction of the plate-shaped silver fine particles (A1) is within a range of 8 to 150 times as large as the thickness,
• wherein an amount of the liquid thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B), and
• wherein an amount of the solvent (F) is from 7 to 20 parts by mass, to 100 parts by mass being the total amount of the silver find particles (A) and the silver powder (B).