High dispensing rate, high thermal conductivity silicone thermal gel with vertical stability and no cracking
AssigneeNano and Advanced Materials Institute Limited
InventorsXiaohua Chen, Jinliang Zhao, Chi Ho Kwok
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Abstract
The present invention relates to a single-part thermal polysiloxane gel which demonstrates remarkable vertical stability, thermal conductivity, and rapid dispensing rate. The present invention is characterized by its polysiloxane polymer network formed by reaction of the components upon mixing, which enables embedding of thermally conductive fillers to further enhance the overall thermal conductivity of the gel, while not compromising in vertical stability. The thermal gel of the present invention is therefore highly suitable for application of electronics and electrical vehicle usage, which may involve high temperature and vertical positioning conditions.
Claims9
A vertically-stable, single-part curable, and high dispense rate thermal conductive polysiloxane gel, comprising:
- a vinyl-functionalized silicone polymer base;
- a silyl-hydride functionalized polysiloxane crosslinker;
- a thermally conductive filler;
- and
- dual-functionalized polyhedral silsesquioxanes comprising methacryloxypropyl and polyethene glycol functional groups;
- wherein the ratio of methacryloxypropyl functional groups to polyethene glycol functional groups in the polyhedral silsesquioxanes is 1:3 to 4:1;
- and
- wherein the dual-functionalized polyhedral silsesquioxanes comprising methacryloxypropyl-functionalized polyhedral silsesquioxanes and polyethene glycol-functionalized polyhedral silsesquioxanes is no more than 2 wt % of the polysiloxane gel.
Dependencies are inferred from the claim text.