Methods to remove an EBC from a substrate and to repair a coated component
AssigneeGeneral Electric Company
InventorsAnant Achyut Setlur, Julin Wan, Andrea Vozar, James Edward Murphy, Claire Susan Henderson
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Abstract
A method is provided for removing a bondcoat and an environmental barrier coating from a coated component. The method may include contacting the coated component with an etchant liquid comprising phosphoric acid, 5% by volume to 70% by volume of hydrogen fluoride, and a solvent. The hydrogen fluoride and the phosphoric acid react with a composition in the bondcoat. The bondcoat is positioned within the coated component between a silicon-containing substrate and the environmental barrier coating, and the bondcoat comprises mullite.
Claims20
A method for removing a coating from a coated component, the method comprising:
- contacting the coated component with an etchant liquid, wherein the etchant liquid comprises phosphoric acid, 5% by volume to 70% by volume of hydrogen fluoride, and a solvent, wherein the coated component includes a coating on a silicon-containing substrate, the coating comprising a bondcoat and an environmental barrier coating, wherein the bondcoat comprises mullite, and wherein the phosphoric acid and the hydrogen fluoride react with the coating to weaken chemical bonds therein to form a chemically-weakened coating, and
- removing the chemically-weakened coating from the silicon-containing substrate.
Dependencies are inferred from the claim text.