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US 12,605,930 B2Granted
Head chip and liquid ejecting head
AssigneeSeiko Epson Corporation
InventorHaruki Kobayashi
Life of this patent
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Abstract
A liquid ejecting head includes a first head chip that includes a first wiring member having flexibility, and a relay substrate that includes a first terminal group α and is electrically coupled to the first wiring member. The first wiring member includes a first terminal group A that is adhered or bonded to the first terminal group α of the relay substrate, and a first terminal group B that is not adhered or bonded to the relay substrate, and the first terminal group A is compatible with the first terminal group B.
Claims18
A liquid ejecting head comprising:
- a first head chip including a first wiring member having flexibility and configured to eject a liquid;
- and
- a relay substrate that includes a first terminal group α and is electrically coupled to the first wiring member, wherein
- the first wiring member includes
- a first terminal group A that is adhered or bonded to the first terminal group α of the relay substrate, and
- a first terminal group B that is not adhered or bonded to the relay substrate, and
- the first terminal group A is compatible with the first terminal group B.
4 more elements
Dependencies are inferred from the claim text.