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AssigneeTokyo Seimitsu Co., Ltd.
InventorsChikara Aikawa, Satoru Iwaki
Estimating the term…
The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.
A laser machining device forming a machined groove along a street on a wafer by relatively moving a laser optical system in a machining feed direction along the street and emitting laser light from the laser optical system to the street, the laser machining device comprising:
A method for controlling a laser machining device configured to form a machined groove along a street on a wafer by relatively moving a laser optical system in a machining feed direction along the street and emitting laser light from the laser optical system to the street, the method comprising:
Dependencies are inferred from the claim text.