# US 12,604,782 B2 · Molded contrast mask for display module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,782 B2 - Document ID: US12604782B2 - Status: Granted - Kind: B2 - Application number: 18/344,517 - Filed: 2023-06-29 - Published: 2023-10-26 - Granted: 2026-04-14 - Earliest claimed: 2019-05-09 - Assignees: Daktronics, Inc. - Applicants: Daktronics, Inc. - Inventors: Ryan Joseph Nielsen; Gregory Lynn Rauen; Matthew Craig Buisker - Web page: https://patentgrep.com/patent/US12604782B2 ## CPC - H10W 90/00: Package configurations - H10H 20/8506: {Containers} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/0363: {of optical field-shaping means} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A display module comprises a circuit board, a plurality of light-emitting elements coupled to a front surface of the circuit board and arranged in an array configured to produce at least a portion of a display image at the front surface of the circuit board, and a contrast mask directly coupled to the front surface of the circuit board, the contrast mask defining a plurality of windows, with each window surrounding a group of one or more of the plurality of light-emitting elements. ## Claims ### Claim 1 A method comprising: providing or receiving a circuit board comprising a front surface and a plurality of contact pads on the front surface, wherein each of the plurality of contact pad is electrically connected to one or more conducting traces on the front surface; directly molding a polymeric material onto at least a portion of the conducting traces or the contact pads, or both, and a portion of the front surface of the circuit board; wherein the direct molding of the polymeric material forms a contrast mask that covers at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface; mounting a plurality of light-emitting elements onto the front surface of the circuit board in an array configured to produce at least a portion of a display image at the front surface of the circuit board; and electrically connecting the plurality of the light-emitting elements to the plurality of the contact pads so that the plurality of light-emitting elements are electrically connected to the conducting traces; wherein the direct molding of the polymeric material comprises forming a plurality of windows in or through the contrast mask to allow for emission of light from the light-emitting elements to produce a display image at the front surface of the circuit board, wherein each window surrounds a group of one or more of the plurality of light-emitting elements. ### Claim 2 (depends on 1) The method of claim 1, wherein each group of one or more of the plurality of light-emitting elements comprises a pixel of two or more of the light-emitting elements, wherein a plurality of the pixels is arranged to provide the array. ### Claim 3 (depends on 2) The method of claim 2, wherein the mounting of the plurality of light-emitting elements comprises mounting adjacent pixels of the plurality of pixels so that the adjacent pixels are spaced apart by a specified pixel pitch. ### Claim 4 (depends on 3) The method of claim 3, wherein the specified pixel pitch is no larger than 4 millimeters. ### Claim 5 (depends on 3) The method of claim 3, wherein the specified pixel pitch is no larger than 2.5 millimeters. ### Claim 6 (depends on 2) The method of claim 2, wherein the contrast mask reduces occurrence of a halo effect around one or more of the pixels. ### Claim 7 (depends on 2) The method of claim 2, wherein the contrast mask enhances contrast between light being emitted by the light-emitting elements and an appearance of dark or black in the display image. ### Claim 8 (depends on 1) The method of claim 1, wherein the direct molding of the polymeric material onto at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface of the circuit board precedes one or both of: the mounting of the plurality of light-emitting elements onto the front surface of the circuit board, and the electrical connecting of the plurality of the light-emitting elements to the plurality of the contact pads. ### Claim 9 (depends on 1) The method of claim 1, wherein the direct molding of the polymeric material onto at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface of the circuit board is after one or both of: the mounting of the plurality of light-emitting elements onto the front surface of the circuit board, and the electrical connecting of the plurality of the light-emitting elements to the plurality of the contact pads. ### Claim 10 (depends on 1) The method of claim 1, wherein the polymeric material comprises at least one of: an epoxy-based polymer, a silicone-based polymer, or a black carbon polymer. ### Claim 11 (depends on 1) The method of claim 1, wherein the polymeric materials comprises a thermoplastic polymer. ### Claim 12 (depends on 2) The method of claim 2, wherein the direct molding of the polymeric material to form the contrast mask comprises forming walls of the polymeric material that surround and separate each pixel and define the plurality of windows. ### Claim 13 (depends on 1) The method of claim 1, wherein the direct molding of the polymeric material to form the contrast mask comprises: directly molding a liquid or softened form of the polymeric material onto the circuit board so that that the liquid or softened form of the polymeric material covers at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface of the circuit board; and setting or curing the liquid or softened form of the polymeric material to form solid polymeric material of the contrast mask. ### Claim 14 (depends on 1) The method of claim 1, wherein the direct molding of the polymeric material to form the contrast mask comprises film-assisted molding of the polymeric material onto at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface of the circuit board. ### Claim 15 (depends on 2) The method of claim 2, wherein each pixel comprises a package comprising the two or more of the light-emitting elements that make up the pixel and supporting electronics that provide for emission of light from the two or more of the light-emitting elements that make up the pixel, wherein a corresponding window formed during the direct molding of the polymeric material surrounds the package so that light emitted by the two or more of the light-emitting elements of the package is emitted through the corresponding window, wherein the mounting of the two or more of light-emitting elements of the package onto the front surface of the circuit board comprises mounting the package onto the front surface of the circuit board, and wherein electrically connecting the two or more of the light-emitting elements of the package comprises electrically connecting one or more of the contact pads to one or more corresponding electrical contacts on the package. ### Claim 16 (depends on 14) The method of claim 14, wherein the film-assisted molding comprises: providing or receiving a mold having a mold cavity with one or more inner surfaces forming an inner surface geometry that corresponds to an outer surface geometry of the contrast mask, wherein the inner surface geometry provides for covering of at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface of the circuit board; positioning a thin film liner within the mold cavity along the one or more inner surfaces; deforming the thin film liner tightly onto the one or more inner surfaces to provide one or more film-lined interior surfaces of the mold cavity, wherein the one or more film-lined interior surfaces have the inner surface geometry; positioning the circuit board in the mold cavity at a specified position relative to the one or more film-lined interior surfaces; injecting a liquid or softened form of the polymeric material into the mold cavity so that the liquid or softened form of the polymeric material forms the outer surface geometry of the contrast mask and covers at least the portion of the conducting traces or the contact pads, or both, and the portion of the front surface of the circuit board; setting or curing the liquid or softened form of the polymeric material to form solid polymeric material in the form of the contrast mask having the outer surface geometry. ### Claim 17 (depends on 16) The method of claim 16, wherein the deforming of the thin film liner comprises one or both of: heating the thin film liner to at least partially melt or soften the thing film liner, and applying a vacuum to the mold to suck the thin film liner tightly onto the one or more inner surfaces of the mold cavity. ### Claim 18 (depends on 16) The method of claim 16, wherein an injection velocity of the liquid or softened form of the polymeric material is sufficiently high during the injecting of the liquid or softened form of the polymeric material that the liquid or softened form of the polymeric material will substantially fill all free space within the mold cavity. ### Claim 19 (depends on 16) The method of claim 16, further comprising applying a vacuum to the mold cavity during one or both of: the injecting of the liquid or softened form of the polymeric material into the mold cavity, and the setting or curing of the liquid form of the polymeric material to form the solid polymeric material of the contrast mask.