Semiconductor module

A semiconductor module, comprising:

• a circuit board;
• a first main wiring pattern provided on the circuit board;
• a first main wiring line connecting portion, which is provided on the first main wiring pattern and to which a first main wiring line portion for applying a first power source voltage is connected;
• a second main wiring pattern provided on the circuit board;
• a second main wiring line connecting portion, which is provided on the second main wiring pattern and to which a second main wiring line portion for applying a second power source voltage is connected;
• a main output wiring pattern provided on the circuit board;
• a main output wiring line connecting portion, which is provided on the main output wiring pattern and to which a main output wiring line portion for outputting an output voltage is connected;
• a first circuit, which is provided on the circuit board and electrically connected between the first main wiring line connecting portion and the main output wiring line connecting portion, and which includes a first transistor device and a first diode device connected inversely in parallel to each other;
• a second circuit, which is provided on the circuit board and electrically connected between the main output wiring line connecting portion and the second main wiring line connecting portion, which includes a second transistor device and a second diode device connected inversely in parallel to each other, and which is arranged alongside each other with the first circuit in a first direction on the circuit board;
• a first auxiliary emitter wiring line for prescribing an electric potential of the first main electrode;
• a second auxiliary emitter wiring line for prescribing an electric potential of the second main electrode;
• a first auxiliary wire for directly connecting the first auxiliary emitter wiring line to the first main electrode;
• and
• a second auxiliary wire for directly connecting the second auxiliary emitter wiring line to the second main electrode, wherein
• the circuit board includes a circuit region in which the first circuit and the second circuit are arranged alongside each other in the first direction, and a first connecting region and a second connecting region arranged sandwiching the circuit region in a second direction orthogonal to the first direction,
• the first main wiring line connecting portion and the second main wiring line connecting portion are provided in the first connecting region,
• the main output wiring line connecting portion is provided in the second connecting region,
• the first transistor device includes a first main electrode provided on an upper surface of the circuit board, and
• the second transistor device includes a second main electrode provided on the upper surface.