# US 12,604,773 B2 · Electronic device having opaque layer with opening for light transmission

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- Number: US 12,604,773 B2
- Document ID: US12604773B2
- Status: Granted
- Kind: B2
- Application number: 18/082,595
- Filed: 2022-12-16
- Published: 2023-07-20
- Granted: 2026-04-14
- Earliest claimed: 2022-01-17
- Assignees: Innolux Corporation
- Applicants: Innolux Corporation
- Inventors: Chiu-Lien Yang; Jia-Yuan Chen; Tsung-Han Tsai; Kuan-Feng Lee; Chung-Wen Yen
- Web page: https://patentgrep.com/patent/US12604773B2

## CPC

- G06V 10/147: Details of sensors, e.g. sensor lenses (fingerprint or palmprint sensors G06V40/13; vascular sensors G06V40/145; eye sensors G06V40/19)
- H10W 90/00: Package configurations
- G06V 40/1318: {using electro-optical elements or layers, e.g. electroluminescent sensing}
- H10W 72/90: Bond pads, in general
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/722: {between stacked chips}
- G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The disclosure provides an electronic device, including: a circuit substrate, an inorganic light emitting unit, and an opaque layer. The circuit substrate includes an optical sensor. The inorganic light emitting unit is disposed on the circuit substrate and is configured to emit a light. The opaque layer is disposed on the circuit substrate, including a first opening through which a portion of the light is transmitted to the optical sensor.

## Claims

### Claim 1

An electronic device, comprising:
a circuit substrate comprising an optical sensor;
an inorganic light emitting unit disposed on the circuit substrate and configured to emit a light; and
an opaque layer disposed on the circuit substrate, comprising a first opening through which a portion of the light is transmitted to the optical sensor, wherein the first opening comprises a plurality of sub-openings.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein a transmittance of the opaque layer with respect to the light is less than 50%.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein the opaque layer comprises a second opening in which the inorganic light emitting unit is disposed.

### Claim 4 (depends on 1)

The electronic device according to claim 1, further comprising:
a lens disposed on the optical sensor and overlapped with the first opening.

### Claim 5 (depends on 1)

The electronic device according to claim 1, wherein the circuit substrate comprises a substrate and the optical sensor is disposed on the substrate.

### Claim 6 (depends on 1)

The electronic device according to claim 1, wherein the circuit substrate comprises a substrate and the optical sensor is disposed under the substrate.

### Claim 7 (depends on 1)

The electronic device according to claim 1, wherein the circuit substrate comprises a semiconductor substrate and the optical sensor is embedded in the semiconductor substrate.

### Claim 8 (depends on 1)

The electronic device according to claim 1, wherein the inorganic light emitting unit is an LED chip.

### Claim 9 (depends on 1)

The electronic device according to claim 1, wherein the optical sensor is configured to sense a fingerprint.

### Claim 10

An electronic device, comprising:
a circuit substrate comprising an optical sensor;
an inorganic light emitting unit disposed on the circuit substrate and configured to emit a light; and
an opaque layer disposed on the circuit substrate, comprising a first opening through which a portion of the light is transmitted to the optical sensor, wherein the opaque layer comprises a metal pad on which the inorganic light emitting unit is bonded.

### Claim 11

An electronic device, comprising:
a circuit substrate comprising an optical sensor;
an inorganic light emitting unit disposed on the circuit substrate and configured to emit a light;
an opaque layer disposed on the circuit substrate, comprising a first opening through which a portion of the light is transmitted to the optical sensor; and
a metal mesh layer disposed on the inorganic light emitting unit, wherein the metal mesh layer comprises a third opening overlapped with the first opening.