# US 12,604,748 B2 · Capacitor pads and methods of manufacturing the same

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- Number: US 12,604,748 B2
- Document ID: US12604748B2
- Status: Granted
- Kind: B2
- Application number: 17/448,288
- Filed: 2021-09-21
- Published: 2023-03-23
- Granted: 2026-04-14
- Earliest claimed: 2021-09-21
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Kristof Darmawikarta; Jung Kyu Han; Srinivas Pietambaram; Rajeev Ranjan
- Web page: https://patentgrep.com/patent/US12604748B2

## CPC

- H10W 70/65: Shapes or dispositions of interconnections
- H10D 1/68: Capacitors having no potential barriers
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/618: {the bridge chips being embedded in the package substrates, interposers or redistribution layers}
- H10W 70/685: comprising multiple insulating layers
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.

## Claims

### Claim 1

An apparatus comprising:
a substrate to support a die; and
a die-side capacitor pad on the substrate, the die-side capacitor pad including:
a plurality of distinct pad portions, the distinct pad portions spaced apart from one another; and
a frame around the plurality of the distinct pad portions, the frame to retain solder material associated with a die-side capacitor, the frame flush with at least one of the distinct pad portions.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein different ones of the distinct pad portions have a same size and a same shape.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the distinct pad portions include a first pad portion, the first pad portion having a cylindrical shape.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the distinct pad portions include a first pad portion, the first pad portion having a rectangular prism shape.

### Claim 5 (depends on 1)

The apparatus of claim 1, including a second pad on the substrate, the second pad to bond with a corresponding bump or pad on the die, the second pad having a first size associated with a first cross-sectional area, each of the distinct pad portions having a second size associated with a second cross-sectional area, the second cross-sectional area being less than or equal to the first cross-sectional area.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein the frame includes a conductive material.

### Claim 7

An apparatus comprising:
a substrate to support a die;
a capacitor including a terminal;
an interconnect extending between the capacitor and the substrate, the interconnect including a first pad on a side of the substrate, the first pad electrically coupling the die to the terminal, the first pad including a plurality of distinct pad portions, each of the distinct pad portions bonded to the terminal of the capacitor; and
a second pad on the side of the substrate, the second pad to electrically couple the substrate to the die, a cross-sectional area of individual ones of the distinct pad portions being less than or equal to a cross-sectional area of the second pad.

### Claim 8 (depends on 7)

The apparatus of claim 7, wherein the first pad includes a frame around the plurality of the distinct pad portions, the frame to retain solder material that provides the bond between the terminal and each of the distinct pad portions.

### Claim 9 (depends on 8)

The apparatus of claim 8, wherein the frame is electrically coupled to at least one of the distinct pad portions.

### Claim 10 (depends on 8)

The apparatus of claim 8, wherein the frame includes a conductive material.

### Claim 11 (depends on 8)

The apparatus of claim 8, wherein the frame is electrically coupled to the terminal and the die.

### Claim 12 (depends on 7)

The apparatus of claim 7, wherein different ones of the distinct pad portions have a same size and a same shape.

### Claim 13 (depends on 7)

The apparatus of claim 7, wherein the distinct pad portions include a first pad portion, the first pad portion having a cylindrical shape.

### Claim 14 (depends on 7)

The apparatus of claim 7, wherein the distinct pad portions include a first pad portion, the first pad portion having a triangular shape.

### Claim 15 (depends on 7)

The apparatus of claim 7, wherein the first pad is a capacitor pad and the second pad is a bridge pad.

### Claim 16 (depends on 7)

The apparatus of claim 7, including a first solder layer on the first pad and a second solder layer on the second pad.

### Claim 17 (depends on 16)

The apparatus of claim 16, wherein the first solder layer and the second solder layer have a same thickness.