# US 12,604,738 B2 · Systems and methods for providing dynamic security fabric interposers in heterogeneously integrated systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,738 B2 - Document ID: US12604738B2 - Status: Granted - Kind: B2 - Application number: 18/227,451 - Filed: 2023-07-28 - Published: 2025-01-30 - Granted: 2026-04-14 - Earliest claimed: 2023-07-28 - Assignees: The Charles Stark Draper Laboratory, Inc. - Applicants: The Charles Stark Draper Laboratory, Inc. - Inventors: Douglas La Tulipe - Web page: https://patentgrep.com/patent/US12604738B2 ## CPC - H10W 42/405: {using active circuits} - H10W 42/40: protecting against tampering, e.g. unauthorised inspection or reverse engineering - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 90/00: Package configurations - H10B 80/00: Assemblies of multiple devices comprising at least one memory device covered by this subclass - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10B: ELECTRONIC MEMORY DEVICES ## Abstract A system may include an integrated circuit (IC) package. The IC package may include one or more IC die hosting one or more circuits, and an interposer. The interposer may be coupled to the one or more IC die via an interconnection layer. The interposer may include one or more electrically active devices configured to provide one or more security functions to secure the one or more circuits. The interposer may be coupled to a backside power of the IC package. In some embodiments, the backside power of the IC package may include one or more backside power delivery networks. ## Claims ### Claim 1 A system comprising an integrated circuit (IC) package, the IC package comprising: one or more IC die hosting one or more circuits; and an interposer coupled to the one or more IC die via an interconnection layer, the interposer comprising one or more electrically active devices configured to provide one or more security functions to secure the one or more circuits, wherein the interposer is coupled to a backside power of the IC package, the one or more IC die include a first IC die and a second IC die wherein the one or more electrically active devices are configured to provide a first connection structure with which the first IC die is connected to the second IC through the interposer, and in response to the first IC die being replaced with a third IC die, the one or more electrically active devices are configured to provide a second connection structure with which the third IC die is connected to the second IC through the interposer. ### Claim 2 (depends on 1) The system according to claim 1, comprising: a passive layer coupled to a first surface of the one or more IC die and including one or more passive components configured to secure the one or more circuits, wherein the interposer is coupled to a second surface of the one or more IC die opposite to the first surface. ### Claim 3 (depends on 1) The system according to claim 1, wherein the one or more IC die include a first IC die hosting a first circuit and a second IC die hosting a second circuit, and one or more electrically active devices are configured to secure the first circuit and the second circuit. ### Claim 4 (depends on 1) The system according to claim 1, wherein the one or more electrically active devices are configured to obfuscate the one or more circuits. ### Claim 5 (depends on 1) The system according to claim 1, wherein the one or more security functions include at least one of (1) controlling one or more intrusion sensors integrated into the interposer, (2) managing one or more on-board encryption symmetric keys, (3) managing an identifier (ID) and/or key unique to an individual IC, (4) managing an interrogation history stored on a secure server, (5) controlling a built-in friable structure that can destroy a die in response to an attempt of removing the structure, and/or (6) root of trust. ### Claim 6 (depends on 1) The system according to claim 1, wherein the backside power of the IC package includes one or more backside power delivery networks. ### Claim 7 An interposer of an integrated circuit (IC) package that includes one or more IC die hosting one or more circuits, the interposer comprising: one or more electrically active devices configured to provide one or more security functions to secure the one or more circuits, wherein the interposer is coupled to a backside power of the IC package, and the interposer is coupled to the one or more IC die via an interconnection layer, wherein the one or more IC die include a first IC die and a second IC die wherein the one or more electrically active devices are configured to provide a first connection structure with which the first IC die is connected to the second IC through the interposer, and in response to the first IC die being replaced with a third IC die, the one or more electrically active devices are configured to provide a second connection structure with which the third IC die is connected to the second IC through the interposer. ### Claim 8 (depends on 7) The interposer according to claim 7, wherein the IC package comprises a passive layer coupled to a first surface of the one or more IC die and including one or more passive components configured to secure the one or more circuits, wherein the interposer is coupled to a second surface of the one or more IC die opposite to the first surface. ### Claim 9 (depends on 7) The interposer according to claim 7, wherein the one or more IC die include a first IC die hosting a first circuit and a second IC die hosting a second circuit, and the one or more electrically active devices are configured to secure the first circuit and the second circuit. ### Claim 10 (depends on 7) The interposer according to claim 7, wherein the one or more electrically active devices are configured to obfuscate the one or more circuits. ### Claim 11 (depends on 7) The interposer according to claim 7, wherein the one or more security functions include at least one of (1) controlling one or more intrusion sensors integrated into the interposer, (2) managing one or more on-board encryption symmetric keys, (3) managing an identifier (ID) and/or key unique to an individual IC, (4) managing an interrogation history stored on a secure server, (5) controlling a built-in friable structure that can destroy a die in response to an attempt of removing the structure, and/or (6) root of trust. ### Claim 12 (depends on 7) The interposer according to claim 7, wherein the backside power of the IC package includes one or more backside power delivery networks. ### Claim 13 A method comprising: mounting, on an interconnection layer, one or more integrated circuit (IC) die hosting one or more circuits forming an interposer to include one or more electrically active devices, coupling the interposer to the one or more IC die via the interconnection layer, the interposer configured to provide one or more security functions to secure the one or more circuits; and coupling a backside of the interposer to one or more backside power delivery networks, wherein the one or more IC die include a first IC die and a second IC die, and the method comprises: configuring the one or more electrically active devices to provide a first connection structure with which the first IC die is connected to the second IC through the interposer, and in response to the first IC die being replaced with a third IC die, configuring the one or more electrically active devices to provide a second connection structure with which the third IC die is connected to the second IC through the interposer. ### Claim 14 (depends on 13) The method according to claim 13, comprising: forming a passive layer to be coupled to a first surface of the one or more IC die and to include one or more passive components configured to secure the one or more circuits, wherein the interposer is coupled to a second surface of the one or more IC die opposite to the first surface. ### Claim 15 (depends on 13) The method according to claim 13, wherein the one or more IC die include a first IC die hosting a first circuit and a second IC die hosting a second circuit, and the method comprises configuring the one or more electrically active devices to secure the first circuit and the second circuit. ### Claim 16 (depends on 13) The method according to claim 13, wherein the one or more security functions include at least one of (1) controlling one or more intrusion sensors integrated into the interposer, (2) managing one or more on-board encryption symmetric keys, (3) managing an identifier (ID) and/or key unique to an individual IC, (4) managing an interrogation history stored on a secure server, (5) controlling a built-in friable structure that can destroy a die in response to an attempt of removing the structure, and/or (6) root of trust.