# US 12,604,736 B2 · Shield to reduce substrate electromagnetic interference and warpage

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- Number: US 12,604,736 B2
- Document ID: US12604736B2
- Status: Granted
- Kind: B2
- Application number: 17/852,816
- Filed: 2022-06-29
- Published: 2024-01-04
- Granted: 2026-04-14
- Earliest claimed: 2022-06-29
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Telesphor Kamgaing; Chu Aun Lim; Eng Huat Goh; Min Suet Lim; Kavitha Nagarajan; Jooi Wah Wong; Chee Kheong Yoon
- Web page: https://patentgrep.com/patent/US12604736B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 72/00: Interconnections or connectors in packages
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments herein relate to systems, apparatuses, techniques, or processes for stiffeners for a surface of a package substrate, where the stiffeners provide EMI/RFI shielding for signal traces or other electrical routings within the package, and in particular for traces at a surface of the package such as microstrip routings. Other embodiments may be described and/or claimed.

## Claims

### Claim 1

An apparatus, comprising:
a substrate with a first side and a second side opposite the first side;
an electrically conductive trace proximate to the first side of the substrate;
a structure over the first side of the substrate, the structure comprising a first portion extending in a first direction and a second portion extending in a second direction different than the first direction;
wherein the first portion is at least partially over the electrically conductive trace; and
wherein the structure is electrically coupled to a ground terminal, the ground terminal beneath the electrically conductive trace, wherein the electrically conductive trace is vertically overlapping with the ground terminal along a vertical axis, and wherein the first portion of the structure is vertically overlapping with the electrically conductive trace and with the ground terminal along the vertical axis.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the structure is secured to the first side of the substrate, and wherein the structure reduces warpage of the substrate.

### Claim 3 (depends on 1)

The apparatus of claim 1, wherein the structure further includes a third portion extending in a third direction different than the first direction or the second direction.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein a material of the structure includes a selected one or more of: steel, copper, aluminum, ceramic, or plastic.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the electrically conductive trace is a part of a microstrip transmission line.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein the electrically conductive trace is at a top layer of the substrate.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein a material of the structure includes a ceramic.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the structure and the electrically conductive trace are electrically isolated from each other.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein the electrically conductive trace includes a plurality of electrically conductive traces.

### Claim 10 (depends on 1)

The apparatus of claim 1, further comprising:
one or more electrically conductive vias electrically coupled with the electrically conductive trace, wherein the one or more electrically conductive vias extend from the electrically conductive trace toward the second side of the substrate; and
wherein the one or more electrically conductive vias are between a portion of the structure and the second side of the substrate.

### Claim 11

A package comprising:
a substrate with a first side and a second side opposite the first side;
a first die on the first side of the substrate and a second die on the second side of the substrate;
an electrically conductive routing proximate to the first side of the substrate, wherein the electrically conductive routing electrically couples the first die with the second die; and
a layer on the first side of the substrate, wherein a portion of the layer is between the first die and the second die, wherein a portion of the electrically conductive routing is between the portion of the layer and the second side of the substrate, wherein the layer is coupled to a ground terminal, the ground terminal beneath the portion of the electrically conductive routing, wherein the portion of the electrically conductive routing is vertically overlapping with the ground terminal along a vertical axis, and wherein the portion of the layer is vertically overlapping with the portion of the electrically conductive routing and with the ground terminal along the vertical axis.

### Claim 12 (depends on 11)

The package of claim 11, wherein the electrically conductive routing is a first electrically conductive routing, and wherein the portion of the layer is a first portion of the layer; and further comprising:
a third die on the first side of the substrate;
a second electrically conductive routing proximate to the first side of the substrate, the second electrically conductive routing electrically coupling the first die with the third die; and
wherein a second portion of the layer is between the first die and the third die, and wherein a portion of the second electrically conductive routing is between the second portion of the layer and the second side of the substrate.

### Claim 13 (depends on 12)

The package of claim 12, wherein the first electrically conductive routing includes a plurality of first electrically conductive routings; and wherein the second electrically conductive routing includes a plurality of second electrically conductive routings.

### Claim 14 (depends on 12)

The package of claim 12, wherein the first electrically conductive routing and the second electrically conductive routing are at a top layer of the substrate.

### Claim 15 (depends on 11)

The package of claim 11, wherein the electrical routing includes a microstrip transmission line.

### Claim 16 (depends on 11)

The package of claim 11, wherein the layer includes a metal.

### Claim 17 (depends on 16)

The package of claim 16, wherein the layer is electrically conductive.

### Claim 18 (depends on 11)

The package of claim 11, wherein the layer is secured to the first side of the substrate with an adhesive.

### Claim 19 (depends on 11)

The package of claim 11, wherein the substrate is a coreless substrate.

### Claim 20 (depends on 11)

The package of claim 11, wherein the substrate has a core with a thickness that is less than 200 μm.

### Claim 21 (depends on 11)

The package of claim 11, wherein the electrical routing is a plurality of electrical routings.

### Claim 22

A method comprising:
providing a substrate having a first side and a second side opposite the first side, the substrate including a metal routing proximate to the first side of the substrate; and
applying a shield that includes a metal to a portion of the first side of the substrate, wherein at least a portion of the metal routing is between the shield and the second side of the substrate, wherein the shield and the metal routing are electrically isolated from each other, wherein the shield is coupled to a ground terminal, the ground terminal beneath the portion of the metal routing, wherein the portion of the metal routing is vertically overlapping with the ground terminal along a vertical axis, and wherein the shield is vertically overlapping with the portion of the metal routing and with the ground terminal along the vertical axis.

### Claim 23 (depends on 22)

The method of claim 22, further comprising coupling a package to the first side of the substrate, wherein the package is electrically coupled with the metal routing.

### Claim 24 (depends on 22)

The method of claim 22, wherein applying a shield further includes securing the shield to the first side of the substrate using an adhesive.