# US 12,604,720 B2 · Through mold interconnect drill feature > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,720 B2 - Document ID: US12604720B2 - Status: Granted - Kind: B2 - Application number: 18/374,585 - Filed: 2023-09-28 - Published: 2024-01-18 - Granted: 2026-04-14 - Earliest claimed: 2019-08-26 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Robert M. Nickerson; Rees Winters; Purushotham Kaushik Muthur Srinath - Web page: https://patentgrep.com/patent/US12604720B2 ## CPC - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/124: {the encapsulations having cavities other than that occupied by chips} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening. ## Claims ### Claim 1 An electronic system, comprising: a bottom package comprising a first package substrate having a top side and an opposite bottom side, a first die coupled to the top side of the first package substrate by interconnects, and underfill material around the interconnects and along an entirety of sidewalls of the first die, a first mold layer over the first package substrate and surrounding the underfill material and the first die, and a through mold interconnect through the first mold layer and laterally adjacent to the first die, the through mold interconnect comprising a first conductive portion on the top surface of the first package substrate, and a second conductive portion on the first conductive portion, the second conductive portion distinct from the first conductive portion, wherein the first conductive portion has a maximum lateral width greater than a maximum lateral width of the second conductive portion, and the bottom package comprising a second mold layer in contact with the first mold layer and a top surface of the first die, the second mold layer having a planar bottom surface along the top surface of the first die; and a top package coupled to the bottom package, the top package comprising a second package substrate having a top side and an opposite bottom side, a second die above and coupled to the top side of the second package substrate by a first wire bond, and a third die over the second die, the third die laterally offset from the second die, and the third die coupled to the top side of the second package substrate by a second wire bond, and a third mold layer over the second die and the third die and over the second package substrate, wherein the first die of the bottom package extends laterally beyond a sidewall of the third die. ### Claim 2 (depends on 1) The electronic system of claim 1, wherein the first conductive portion of the through mold interconnect is a solder ball. ### Claim 3 (depends on 1) The electronic system of claim 1, wherein the second conductive portion of the through mold interconnect is a solder ball. ### Claim 4 (depends on 1) The electronic system of claim 1, wherein the first conductive portion of the through mold interconnect is a first solder ball, and wherein the second conductive portion of the through mold interconnect is a second solder ball. ### Claim 5 (depends on 1) The electronic package of claim 1, wherein the through mold interconnect of the bottom package is in a through mold opening, and wherein the through mold opening has a first sloped sidewall and a second sloped sidewall from a cross-sectional perspective. ### Claim 6 (depends on 5) The electronic package of claim 5, wherein a center of the through mold interconnect of the bottom package is offset from a center of the through mold opening. ### Claim 7 (depends on 1) The electronic package of claim 1, wherein the through mold interconnect of the bottom package is in a through mold opening, and a center of the through mold interconnect is offset from a center of the through mold opening. ### Claim 8 An electronic system, comprising: a lower package comprising a first package substrate, a first die coupled to the first package substrate by first interconnects, and capillary underfill around the first interconnects and along an entirety of sidewalls of the first die, a first mold material over the first package substrate and surrounding the capillary underfill with a curved interface between the first mold material and the capillary underfill, and a second interconnect through the first mold material and laterally adjacent to the first die, the second interconnect comprising a first conductive portion on the first package substrate, and a second conductive portion on the first conductive portion, the second conductive portion distinct from the first conductive portion, wherein the first conductive portion has a maximum lateral width greater than a maximum lateral width of the second conductive portion, and the lower package comprising a second mold material in contact with the first mold material and a top surface of the first die, the second mold material having a planar bottom surface along the top surface of the first die; and an upper package coupled to the lower package, the upper package comprising a second package substrate, a second die above and coupled to the second package substrate by a first wire bond, and a third die over the second die, the third die laterally offset from the second die, and the third die coupled to the second package substrate by a second wire bond, and a third mold material over the second die and the third die and over the second package substrate, wherein the first die of the lower package extends laterally beyond a sidewall of the third die. ### Claim 9 (depends on 8) The electronic system of claim 8, wherein the first conductive portion of the second interconnect is a solder ball. ### Claim 10 (depends on 8) The electronic system of claim 8, wherein the second conductive portion of the second interconnect is a solder ball. ### Claim 11 (depends on 8) The electronic system of claim 8, wherein the first conductive portion of the second interconnect is a first solder ball, and wherein the second conductive portion of the second interconnect is a second solder ball. ### Claim 12 (depends on 8) The electronic package of claim 8, wherein the second interconnect is in an opening in the first mold material, and wherein the opening has a first sloped sidewall and a second sloped sidewall. ### Claim 13 (depends on 8) The electronic package of claim 8, wherein the second interconnect is in an opening in the first mold material, and a center of the second interconnect is offset from a center of the opening. ### Claim 14 An electronic system, comprising: a first package substrate having a top side and an opposite bottom side; a first die coupled to the top side of the first package substrate by interconnects; underfill material around the interconnects and along an entirety of sidewalls of the first die; a first mold layer over the first package substrate and surrounding the underfill material and the first die; a through mold interconnect through the first mold layer and laterally adjacent to the first die, the through mold interconnect comprising a first conductive portion on the top surface of the first package substrate, and a second conductive portion on the first conductive portion, the second conductive portion distinct from the first conductive portion, wherein the first conductive portion has a maximum lateral width greater than a maximum lateral width of the second conductive portion; a second mold layer in contact with the first mold layer and a top surface of the first die, the second mold layer having a planar bottom surface along the top surface of the first die; a second package substrate above the first die, the second mold layer and the first mold layer, the second package substrate having a top side and an opposite bottom side; a second die above and coupled to the top side of the second package substrate by a first wire bond; a third die over the second die, the third die laterally offset from the second die, and the third die coupled to the top side of the second package substrate by a second wire bond, wherein the first die extends laterally beyond a sidewall of the third die; and a third mold layer over the second die and the third die and over the second package substrate. ### Claim 15 (depends on 14) The electronic system of claim 14, wherein the first conductive portion of the through mold interconnect is a solder ball. ### Claim 16 (depends on 14) The electronic system of claim 14, wherein the second conductive portion of the through mold interconnect is a solder ball. ### Claim 17 (depends on 14) The electronic system of claim 14, wherein the first conductive portion of the through mold interconnect is a first solder ball, and wherein the second conductive portion of the through mold interconnect is a second solder ball. ### Claim 18 (depends on 14) The electronic package of claim 14, wherein the through mold interconnect is in a through mold opening, and wherein the through mold opening has a first sloped sidewall and a second sloped sidewall from a cross-sectional perspective. ### Claim 19 (depends on 18) The electronic package of claim 18, wherein a center of the through mold interconnect is offset from a center of the through mold opening. ### Claim 20 (depends on 14) The electronic package of claim 14, wherein the through mold interconnect is in a through mold opening, and a center of the through mold interconnect is offset from a center of the through mold opening.