# US 12,604,716 B2 · Interconnect with two-dimensional free zero line end enclosure

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- Number: US 12,604,716 B2
- Document ID: US12604716B2
- Status: Granted
- Kind: B2
- Application number: 17/808,316
- Filed: 2022-06-23
- Published: 2023-12-28
- Granted: 2026-04-14
- Earliest claimed: 2022-06-23
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Ruilong Xie; Albert M. Chu; Nicholas Anthony Lanzillo; Lawrence A. Clevenger; Huai Huang
- Web page: https://patentgrep.com/patent/US12604716B2

## CPC

- H10W 20/069: {by forming self-aligned vias or self-aligned contact plugs}
- H10W 20/063: {by forming conductive members before forming protective insulating material}
- H10W 20/0633: {using subtractive patterning of the conductive members}
- H10W 20/0693: {by forming self-aligned vias}
- H10W 20/0696: {by using sacrificial placeholders, e.g. using sacrificial plugs}
- H10W 20/089: {using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning}
- H10W 20/43: Layouts of interconnections
- H10W 20/435: {Cross-sectional shapes or dispositions of interconnections}
- H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments of the invention include providing interconnects with two-dimensional free zero line end enclosure. A first metal line is formed. A second metal line is connected by a via to the first metal line, the first metal line having a first end with a zero line extension in relation to the via in a first dimension, the second metal line having another first end with a zero line extension in relation to the via in a second dimension perpendicular to the first dimension.

## Claims

### Claim 1

An interconnect structure comprising:
a first metal line; and
a second metal line connected by a via to the first metal line, the first metal line having a first end with a zero line extension in relation to the via in a first dimension, the second metal line having another first end with another zero line extension in relation to the via in a second dimension perpendicular to the first dimension, wherein the first metal line comprises a positive tapered angle, the second metal line comprises a negative tapered angle, and the via comprises a positive tapered angle.

### Claim 2 (depends on 1)

The interconnect structure of claim 1, wherein the first metal line and the second metal line are formed adjacent to opposing ends of the via.

### Claim 3 (depends on 1)

The interconnect structure of claim 1, wherein the first metal line, the second metal line, and the via are connected to form an “L” shaped layout.

### Claim 4 (depends on 1)

The interconnect structure of claim 1, wherein:
the via comprises a first edge and a second edge;
an edge of the first metal line is formed so as to avoid extending beyond the first edge of the via in the first dimension, thereby having the first end with the zero line extension in relation to the via; and
an edge of the second metal line is formed so as to avoid extending beyond the second edge of the via in the second dimension, thereby having the another first end with the another zero line extension in relation to the via.

### Claim 5 (depends on 1)

The interconnect structure of claim 1, wherein:
the via comprises a first edge and a second edge;
an edge of the first metal line is formed so as to avoid extending beyond the first edge of the via in the first dimension, thereby having the first end with the zero line extension in relation to the via; and
another edge of the first metal line is formed so as to avoid extending beyond the second edge of the via in the second dimension, thereby having a second end with a further zero line extension in relation to the via.

### Claim 6 (depends on 1)

The interconnect structure of claim 1, wherein the first metal line has a liner at a bottom, the second metal line having a liner at a bottom and a sidewall.

### Claim 7 (depends on 1)

The interconnect structure of claim 1, wherein the via comprises a height dimension greater than the first metal line, the via comprising the height dimension greater than the second metal line.

### Claim 8 (depends on 1)

The interconnect structure of claim 1, wherein a top surface of the via is coplanar with a top surface of the second metal line.

### Claim 9 (depends on 1)

The interconnect structure of claim 1, wherein:
the via comprises a footing over a portion of the first metal line; and
the via and the first metal line comprise a cut edge, the footing being opposite the cut edge.

### Claim 10

A method comprising:
forming a first metal line; and
forming a second metal line connected by a via to the first metal line, the first metal line having a first end with a zero line extension in relation to the via in a first dimension, the second metal line having another first end with another zero line extension in relation to the via in a second dimension perpendicular to the first dimension, wherein the first metal line comprises a positive tapered angle, the second metal line comprises a negative tapered angle, and the via comprises a positive tapered angle.

### Claim 11 (depends on 10)

The method of claim 10, wherein the first metal line and the second metal line are formed adjacent to opposing ends of the via.

### Claim 12 (depends on 10)

The method of claim 10, wherein the first metal line, the second metal line, and the via are connected to form an “L” shaped layout.

### Claim 13 (depends on 10)

The method of claim 10, wherein:
the via comprises a first edge and a second edge;
an edge of the first metal line is formed so as to avoid extending beyond the first edge of the via in the first dimension, thereby having the first end with the zero line extension in relation to the via; and
an edge of the second metal line is formed so as to avoid extending beyond the second edge of the via in the second dimension, thereby having the another first end with the another zero line extension in relation to the via.

### Claim 14 (depends on 10)

The method of claim 10, wherein:
the via comprises a first edge and a second edge;
an edge of the first metal line is formed so as to avoid extending beyond the first edge of the via in the first dimension, thereby having the first end with the zero line extension in relation to the via; and
another edge of the first metal line is formed so as to avoid extending beyond the second edge of the via in the second dimension, thereby having a second end with a further zero line extension in relation to the via.

### Claim 15 (depends on 10)

The method of claim 10, wherein:
the first metal line has a liner at a bottom, the second metal line having a liner at a bottom and a sidewall;
the via comprises a height dimension greater than the first metal line, the via comprising the height dimension greater than the second metal line; and
a top surface of the via is coplanar with a top surface of the second metal line.

### Claim 16 (depends on 10)

The method of claim 10, wherein:
the via comprises a footing over a portion of the first metal line; and
the via and the first metal line comprise a cut edge, the footing being opposite the cut edge.

### Claim 17

A method comprising:
forming a merged via over a bottom metal line;
forming top dummy lines;
etching portions of the merged via unprotected by the top dummy lines resulting in self-aligned vias, the self-aligned vias being aligned to locations of the top dummy lines;
cutting the bottom metal line according to a spacing between the top dummy lines;
removing the top dummy lines;
forming trenches adjacent to upper portions of the self-aligned vias, the trenches being formed in dielectric material; and
forming top metal lines respectively in the trenches so as to be self-aligned to the self- aligned vias.

### Claim 18 (depends on 17)

The method of claim 17, wherein the top metal lines are respectively adjacent to upper portions of the self-aligned vias.