# US 12,604,707 B2 · Method including positioning a source die or a destination site to compensate for overlay error

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- Number: US 12,604,707 B2
- Document ID: US12604707B2
- Status: Granted
- Kind: B2
- Application number: 18/491,556
- Filed: 2023-10-20
- Published: 2025-04-24
- Granted: 2026-04-14
- Earliest claimed: 2023-10-20
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Byung-Jin Choi
- Web page: https://patentgrep.com/patent/US12604707B2

## CPC

- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/072: {of bump connectors}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 80/163: {using active alignment, e.g. detecting marks and correcting position}
- H10W 80/312: {characterised by the direct bonding of electrically conductive pads}
- H10W 80/327: {characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method can include bonding a first source die to a first destination site of a destination substrate, wherein the first source die includes a source metrology pattern including a source alignment mark, and the first destination site includes a destination metrology pattern including a destination alignment mark. The method can include collecting radiation data regarding the source and destination metrology patterns within a radiation area. The source alignment mark does not directly overlie or directly underlie any alignment mark of the destination metrology pattern. The method can further include analyzing the radiation data to determine an overlay error between the first source die and the first destination site; and adjusting a position of a second source die or a second destination site of the destination substrate to compensate for the overlay error between the first source die and the first destination site.

## Claims

### Claim 1

A method, comprising:
bonding a first source die to a first destination site of a destination substrate, wherein:
the first source die includes a first source active region and a first source boundary region, wherein the first source active region includes a first source active contact pad, and the first source boundary region includes a first source metrology pattern including a first source alignment mark, and
the first destination site includes a first destination active region and a first destination boundary region, wherein the first destination active region includes a first destination active contact pad, and the first destination boundary region includes a first destination metrology pattern including a first destination alignment mark, and
after bonding, the first source active contact pad contacts the first destination active contact pad;
collecting first radiation data regarding at least portions of the first source metrology pattern and the first destination metrology pattern within a first radiation area, wherein collecting the first radiation data is performed after bonding the first source die to the first destination site, and within the first radiation area, the first source alignment mark does not directly overlie or directly underlie any alignment mark of the first destination metrology pattern;
analyzing the first radiation data to determine a first overlay error between the first source die and the first destination site; and
adjusting a position of a second source die or a second destination site of the destination substrate to compensate for the first overlay error between the first source die and the first destination site.

### Claim 2 (depends on 1)

The method of claim 1, further comprising irradiating the first radiation area with a radiation, wherein:
the first source metrology pattern comprises a set of source alignment marks that includes the first source alignment mark,
the first destination metrology pattern comprises a set of destination alignment marks, including the first destination alignment mark, and
during irradiating the first radiation area, no more than 25% of the radiation is transmitted through each alignment mark of the source alignment marks and the destination alignment marks.

### Claim 3 (depends on 1)

The method of claim 1, wherein irradiating the first radiation area is performed using infrared radiation.

### Claim 4 (depends on 1)

The method of claim 1, wherein:
the first source metrology pattern includes a set of source alignment marks, including the first source alignment mark, along a first source bonding surface, and
the first destination metrology pattern includes a set of destination alignment marks, including the first destination alignment mark, along a first destination bonding surface.

### Claim 5 (depends on 4)

The method of claim 4, wherein none of the source alignment marks within the first source metrology pattern contacts any of the destination alignment marks within the first destination metrology pattern.

### Claim 6 (depends on 4)

The method of claim 4, wherein:
the set of source alignment marks includes a source array of dummy contact pads, wherein the first source alignment mark is a dummy contact pad within the source array of dummy contact pads, and
the first destination metrology pattern includes a destination array of dummy contact pads, wherein the first destination alignment mark is a particular dummy contact pad within the destination array of dummy contact pads.

### Claim 7 (depends on 6)

The method of claim 6, wherein the source array is phase shifted by an angle in a range from 90° to 270° relative to the destination array.

### Claim 8 (depends on 4)

The method of claim 4, further comprising irradiating the first radiation area with a radiation, wherein,
within the first radiation area, the first source metrology pattern comprises a relatively non-transmissive portion with respect to the radiation and a relatively transmissive portion with respect to the radiation,
the relatively non-transmissive portion of the first source metrology pattern includes the set of source alignment marks,
the relatively transmissive portion of the first source metrology pattern is disposed between the source alignment marks, and
the source alignment marks are only within the relatively non-transmissive portion, and no source alignment mark is within the relatively transmissive portion.

### Claim 9 (depends on 4)

The method of claim 4, wherein analyzing comprises analyzing the first radiation data using a spatial frequency analysis.

### Claim 10 (depends on 9)

The method of claim 9, wherein:
the first source metrology pattern, the first destination metrology pattern, or each of the first source metrology pattern and the first destination metrology pattern has a pitch and a size of a particular alignment mark corresponding to the pitch,
a quotient is the pitch divided by the size of the particular alignment mark corresponding to the pitch,
the pitch and the size of the particular alignment mark corresponding to the pitch corresponds to a value in a frequency domain, and
the value is the quotient +/−10% of the quotient and is in a range from 1.5 to 9.0.

### Claim 11 (depends on 1)

The method of claim 1, further comprising irradiating the first radiation area with a radiation, wherein collecting radiation data is performed using a radiation detector, and wherein the radiation detector has a depth of focus of at most 9 μm.

### Claim 12 (depends on 1)

The method of claim 1, wherein:
the first destination boundary region is disposed between a first dicing lane and the first destination active region, and
none of the first destination active region is disposed between the first dicing lane and the first destination boundary region.

### Claim 13 (depends on 1)

The method of claim 1, further comprising:
bonding the second source die to the second destination site of the destination substrate, wherein the second source die includes a second source metrology pattern, and the second destination site includes a second destination metrology pattern, wherein the second source metrology pattern is identical to the first source metrology pattern, and the second destination metrology pattern is identical to the first destination metrology pattern;
collecting second radiation data regarding at least portions of the second source metrology pattern and the second destination metrology pattern within a second radiation area, wherein collecting the second radiation data is performed after bonding the second source die to the second destination site; and
analyzing the second radiation data to determine a second overlay error between the second source die and the second destination site.

### Claim 14 (depends on 13)

The method of claim 13, wherein the first overlay error is in a first direction, and the second overlay error is in a second direction that is different from the first direction.

### Claim 15 (depends on 13)

The method of claim 13, wherein the first overlay error is in a first direction, and the second overlay error is in a second direction that is the same as the first direction.

### Claim 16 (depends on 13)

The method of claim 13, wherein the first source die and the second source die are different source dies, and the first destination site and the second destination site are different destination sites.

### Claim 17 (depends on 16)

The method of claim 16, wherein the first source die and the second source die have identical electrical circuits.

### Claim 18 (depends on 13)

The method of claim 13, determining an updated overlay error that is a sum of the first overlay error and the second overlay error.

### Claim 19 (depends on 13)

The method of claim 13, wherein:
the method further comprising testing a combination of the second source die and the second destination die using an electrical test to determine whether or not a second source active contact pad of the second source die and a second destination active contact pad of the second destination site are electrically connected to each other, and
the combination of the second source die and the second destination die passes the electrical test.

### Claim 20 (depends on 1)

The method of claim 1, wherein the first source die is a bad source die, and the first destination site is at least part of a bad destination die.

### Claim 21 (depends on 20)

The method of claim 20, wherein the second source die is a known good source die, and the second destination site is at least part of a known good destination die.