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US 12,604,706 B2Granted
Apparatus including transparent material for transparent process performance and method using thereof
AssigneeIntel Corporation
InventorsHuynh Hai Phuong Nguyen, Huy Hoang Nguyen, Le Thach Hoang Nguyen
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Abstract
An apparatus includes a first glass plate, and an outer layer disposed over the first glass plate. The first glass plate and the outer layer are configured to hold a semiconductor die disposed on the first glass plate, and a solder preform interposed between the semiconductor die and the outer layer. The solder preform is viewable through the first glass plate.
Claims20
An apparatus comprising:
- a first glass plate;
- and
- an outer layer disposed over the first glass plate,
- wherein the first glass plate and the outer layer are configured to removably hold a semiconductor die comprising a first surface, with a solder preform disposed thereon, and a second surface that is disposed on the first glass plate, and
- wherein the solder preform is interposed between the semiconductor die and the outer layer,
- wherein the solder preform is viewable through the first glass plate,
- wherein the outer layer comprises a second glass plate disposed on the solder preform, and
- wherein the solder preform is viewable through the second glass plate.
5 more elements
A method comprising:
- forming a semiconductor die on a first glass plate,
- wherein an outer layer is disposed over the first glass plate;
- forming a solder preform on the semiconductor die, to form a testing device;
- determining whether the solder preform is melted, based on an input from a user or an image recognition device that visually analyzes the solder preform viewable through the first glass plate,
- wherein the outer layer comprises a second glass plate disposed on the solder preform, and
- wherein the solder preform is viewable through the second glass plate;
- and
- based on the solder preform being determined to be melted, decreasing a temperature that is used to form the solder preform.
5 more elements
A non-transitory computer-readable medium comprising instructions, which, if executed by a processor, cause the processor to:
- control a semiconductor fabrication device to form a semiconductor die on a first glass plate,
- wherein an outer layer is disposed over the first glass plate;
- control the semiconductor fabrication device to form a solder preform with a first shape on the semiconductor die, to form a testing device;
- determine whether the solder preform is melted to form a second shape, based on an input from a user or an image recognition device that visually analyzes the solder preform viewable through the first glass plate,
- wherein the outer layer comprises a second glass plate disposed on the solder preform, and
- wherein the solder preform is viewable through the second glass plate;
- and
- based on the solder preform being determined to be melted, decrease a temperature that is used to form the solder preform.
5 more elements
Dependencies are inferred from the claim text.