# US 12,604,701 B2 · Modular wafer-chuck system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,701 B2 - Document ID: US12604701B2 - Status: Granted - Kind: B2 - Application number: 18/268,086 - Filed: 2021-12-17 - Published: 2024-02-22 - Granted: 2026-04-14 - Earliest claimed: 2020-12-18 - Assignees: ATT Advanced Temperature Test Systems GmbH - Applicants: ATT Advanced Temperature Test Systems GmbH - Inventors: Markus Eibl - Web page: https://patentgrep.com/patent/US12604701B2 ## CPC - H10P 72/0602: {Temperature monitoring} - G01R 31/2874: {related to temperature} - H10P 72/0434: {mainly by convection} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A modular wafer-chuck system is provided for mounting or clamping and temperature control of a wafer. The modular wafer-chuck system includes: a chuck for temperature control of a wafer; and a sensor module with at least one temperature-measuring apparatus for measuring a temperature of the sensor module and/or of the chuck and/or of a wafer mounted or clamped by the wafer-chuck system. The chuck has a coupling surface configured to detachably couple the sensor module, and the sensor module has a coupling surface configured to mount or clamp a wafer. ## Claims ### Claim 1 A modular wafer-chuck system (40) for mounting or clamping and temperature control of a wafer (2), comprising: a chuck (1) for temperature control of a wafer (2); a sensor module (42) comprising at least one temperature-measuring means (6) for measuring a temperature of the sensor module (42) and/or of the chuck (1) and/or of a wafer (2) mounted or clamped by the wafer-chuck system; wherein the chuck (1) has a coupling surface (1a) configured to detachably couple the sensor module (42); and wherein the sensor module (42) has a first coupling surface (42a) configured to mount or clamp a wafer (2), and a second coupling surface (42b) for coupling with the coupling surface (1a) of the chuck (1) with the aid of a negative pressure and/or a vacuum and/or an applied magnetic field; and wherein the first coupling surface (42a) of the sensor module (42) is arranged on a side of the sensor module (42) facing away from the chuck (1). ### Claim 2 (depends on 1) The modular wafer chuck system (40) of claim 1, wherein the chuck (1) and/or the sensor module (42) are self-contained units and can be used individually and/or independently of one another. ### Claim 3 (depends on 1) The modular wafer-chuck system (40) of claim 1, wherein the chuck and/or the sensor module (42) comprises at least one vacuum chamber (44) for mounting or clamping a wafer. ### Claim 4 (depends on 3) The modular wafer-chuck system (40) of claim 3, wherein the chuck and/or the sensor module (42) have at least one connection device (50) for connecting a vacuum line (52). ### Claim 5 (depends on 1) The modular wafer-chuck system (40) of claim 1, further comprising an insulation layer (46) for detachable coupling with the chuck (1) and/or the sensor module (42). ### Claim 6 (depends on 1) The modular wafer-chuck system (40) of claim 1, wherein the sensor module (42) comprises a first communication interface (12a) for communicating with a temperature-measuring unit (43), wherein the first communication interface (12a) is suitable for transmitting electrical signals from the at least one temperature-measuring means (6), and the temperature-measuring unit (43) is suitable for receiving electrical signals from the at least one temperature-measuring means (6) of the sensor module (42). ### Claim 7 (depends on 1) The modular wafer-chuck system (40) of claim 1, wherein the chuck (1) for temperature control of the chuck (1) and/or of the sensor module (42) and/or of a mounted or clamped wafer (2) comprises: a second communication interface (12b) for supplying and/or draining a temperature control medium (18) into or out of the chuck (1); and/or a third communication interface (12c) for communicating with at least one electrothermal converter (9) of the chuck (1). ### Claim 8 (depends on 7) The modular wafer-chuck system (40) of claim 7, further comprising: a control unit (14) of a temperature control device (10) in connection with the temperature-measuring unit (43) and the second and/or third communication interface (12b, 12c) for: controlling or regulating the temperature of the chuck (1) and/or of the sensor module (42) and/or of the wafer (2) based on the measured temperature of the sensor module (42) and/or of the chuck (1) and/or of the wafer (2). ### Claim 9 (depends on 1) The modular wafer-chuck system (40) of claim 1, further comprising: a first communication interface (12a) for communicating with the chuck (1), the first communication interface being suitable for transmitting electrical signals; a control unit (14) in connection with the first communication interface (12a) for: receiving electrical signals from a plurality of temperature-measuring means (6) in the sensor module (42); selecting at least one of the temperature-measuring means (6) as a reference temperature-measuring means; controlling or regulating the temperature of the chuck (1) based on the temperature(s) of the sensor module (42) or of the chuck (1) or of the wafer (2) measured by the selected reference temperature-measuring means. ### Claim 10 A sensor module (42) for coupling to a chuck (1) of a modular wafer-chuck system (40), comprising: at least one temperature-measuring means (6) for measuring a temperature of the sensor module (42) and/or of a coupled chuck (1) and/or of a wafer (2) mounted or clamped by the sensor module (40) and/or by the chuck (1); a first coupling surface (42a) for mounting or clamping a wafer (2); and a second coupling surface (42b) for coupling with a chuck (1) with the aid of negative pressure and/or vacuum and/or an applied magnetic field, wherein the first coupling surface (42a) of the sensor module (42) is configured to be arranged on a side of the sensor module (42) facing away from the chuck (1). ### Claim 11 (depends on 10) The sensor module (40) of claim 10, further comprising: a plurality of temperature-measuring means (6); and/or at least one vacuum chamber (44) for mounting or clamping a wafer (2); and/or a connection device (50) for connecting a vacuum line (52); and/or a first communication interface (12a) for communicating with a temperature-measuring unit (43) for controlling the temperature of a chuck (1), wherein the first communication interface (12a) is suitable for transmitting electrical signals from the at least one temperature-measuring means (6), and the temperature-measuring unit (43) is suitable for receiving electrical signals from the at least one temperature-measuring means (6) of the sensor module (42). ### Claim 12 A method for arranging modules of a modular wafer-chuck system (40), comprising: providing a chuck (1) for temperature control of a wafer (2); coupling a sensor module (42) to a coupling surface (1a) of the chuck (1) with the aid of negative pressure and/or vacuum and/or an applied magnetic field; wherein the sensor module (42) comprises: a first coupling surface (42a) configured to mount or clamp a wafer (2); and at least one temperature-measuring means (6) for measuring a temperature of the sensor module (42) and/or of the chuck (1) and/or of a wafer (2) mounted or clamped by the wafer-chuck system wherein the first coupling surface (42a) of the sensor module (42) is configured to be arranged on a side of the sensor module (42) facing away from the chuck (1). ### Claim 13 (depends on 12) The method of claim 12, further comprising the step of: mounting or clamping a wafer (2) with a second coupling surface (42a) of the sensor module; and, preferably, temperature control of the chuck (1), the sensor module (42) and/or the mounted or clamped wafer (2). ### Claim 14 (depends on 13) The method of claim 13, further comprising the steps of: detecting the position of a test means (22) for testing a wafer (2); determining the respective spatial distances between the test means (22) and a plurality of temperature-measuring means (6) for measuring a temperature of the chuck (1) or of the sensor module (42) or of a wafer (2) mounted or clamped by the chuck (1); selecting at least one temperature-measuring means (6) among the plurality of temperature-measuring means (6) as a reference temperature-measuring means; controlling or regulating the temperature of the chuck (1) based on the temperature(s) of the chuck (1) or the sensor module (42) or the wafer (2) measured by the selected reference temperature-measuring means. ### Claim 15 (depends on 12) The method of claim 12, further comprising the steps of: detecting the position of a test means (22) for testing a wafer (2); determining the respective spatial distances between the test means (22) and a plurality of temperature-measuring means (6) for measuring a temperature of the chuck (1) or of the sensor module (42) or of a wafer (2) mounted or clamped by the chuck (1); selecting at least one temperature-measuring means (6) among the plurality of temperature-measuring means (6) as a reference temperature-measuring means; controlling or regulating the temperature of the chuck (1) based on the temperature(s) of the chuck (1) or the sensor module (42) or the wafer (2) measured by the selected reference temperature-measuring means.