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US 12,604,699 B2Granted
Processing apparatus
AssigneeDisco Corporation
InventorYunfeng Yang
Life of this patent
Estimating the term…
Abstract
A processing apparatus includes a holding table including a holding surface that holds a back surface side of a substrate and a processing unit that processes the substrate held on the holding surface. The holding surface includes a holding section that holds a central region of the substrate, a discharge groove that surrounds the holding section, and an outer circumferential groove that surrounds the discharge groove and communicates with a suction source to hold under suction the substrate. The processing apparatus uses the discharge groove to collect processing swarf produced by the processing unit.
Claims15
A processing apparatus comprising:
- a holding table including a holding surface that holds a back surface side of a substrate, wherein the holding table includes a frame body with a recess formed therein;
- and
- a processing unit that processes the substrate held on the holding surface, wherein:
- the holding surface includes:
- a holding section, including a porous holding member, that holds a central region of the substrate, wherein the porous holding member comprises a plate that is seated within the recess formed in the frame body,
- a plurality of arcuate discharge grooves that are arranged in an annular manner to surround the porous holding member, wherein adjacent ones of the plurality of arcuate discharge grooves are each separated by a coupling section that defines a portion of the holding surface of the holding table,
- an outer circumferential groove that surrounds the arcuate discharge grooves and communicates with a suction source to hold under suction the substrate, wherein the plurality of arcuate discharge grooves and the outer circumferential groove are both formed in the frame body, and
- a suction channel provided in at least one of the coupling sections, wherein the suction channel communicates a suction force from the suction source to the outer circumferential groove, and
- wherein processing swarf produced by the processing unit is collected by the plurality of arcuate discharge grooves, and
- wherein the holding surface includes both an upper surface of the porous holding member and an upper surface of the frame body, and
- wherein the processing apparatus further comprises:
- a liquid supply unit that supplies liquid to the substrate, and
- wherein the arcuate discharge grooves collect the liquid containing the processing swarf.
10 more elements
A processing apparatus comprising:
- a holding table including a holding surface that holds a back surface side of a substrate, wherein the holding table includes a frame body with a recess formed therein;
- a processing unit that processes the substrate held on the holding surface;
- and
- a liquid supply unit that supplies liquid to the substrate,
- wherein the holding surface includes:
- a holding section, including a porous holding member, that holds a central region of the substrate, wherein the porous holding member is seated within the recess of the frame body,
- a discharge groove that surrounds the porous holding member, and
- an outer circumferential groove that surrounds the discharge groove and that is configured and arranged to hold the substrate under suction, wherein the plurality of discharge grooves and the outer circumferential groove are both formed in the frame body, and
- wherein:
- processing swarf produced by the processing unit is collected by the discharge groove,
- the discharge groove is connected to a suction source,
- the holding surface is formed smaller than the substrate, and further wherein an outer peripheral portion of the substrate is not in contact with any portion of the holding table when the back surface of the substrate is being held by the holding surface of the holding table, and still further wherein the holding surface includes both an upper surface of the porous holding member and an upper surface of the frame body,
- the processing unit includes a cutting blade held in a rotatable manner by a spindle, and
- the processing apparatus removes an outer circumferential portion that is part of the substrate and that is exposed from the holding surface, by moving the holding table and the cutting blade relative to each other while positioning the cutting blade on the outer circumferential portion of the substrate and supplying to the substrate cutting water that is the liquid.
11 more elements
A method of processing a substrate on a processing apparatus that includes a holding table including a holding surface configured for holding a back surface side of the substrate, wherein the holding table includes a frame body with a recess formed therein;
- a processing unit that processes the substrate held on the holding surface;
- and a liquid supply unit that supplies liquid to the substrate, wherein the holding surface includes:
- a holding section, including a porous holding member, that holds a central region of the substrate, wherein the porous holding member is seated within the recess of the frame body;
- a plurality of discharge grooves that surround the porous holding member and that are connected to a suction source, wherein adjacent ones of the plurality of discharge grooves are each separated by a coupling section that defines a portion of the holding surface of the holding table;
- an outer circumferential groove that surrounds the discharge grooves and communicates with a suction source to hold under suction the substrate, wherein the plurality of discharge grooves and the outer circumferential groove are both formed in the frame body;
- and a suction channel provided in at least one of the coupling sections, wherein the suction channel communicates a suction force from the suction source to the outer circumferential groove;
- and the holding surface is formed smaller than the substrate, wherein the holding surface includes both an upper surface of the porous holding member and an upper surface of the frame body, wherein the plurality of discharge grooves collect the liquid containing processing swarf, and wherein the processing unit includes a cutting blade held in a rotatable manner by a spindle, wherein the method comprises:
- positioning the substrate on the holding surface of the holding table such that an outer peripheral portion of the substrate is not in contact with any portion of the holding table when the back surface of the substrate is being held by the holding surface of the holding table;
- and
- removing an outer circumferential portion that is part of the substrate and that is exposed from the holding surface, by moving the holding table and the cutting blade relative to each other while positioning the cutting blade on the outer circumferential portion of the substrate and supplying to the substrate cutting water that is the liquid.
7 more elements
Dependencies are inferred from the claim text.