Thin film deposition method and manufacturing method of electronic device applying the same

A thin film deposition method for a substrate structure having a three-dimensional pattern portion, comprising:

• preparing a substrate structure having an opening region formed in a vertical direction and a plurality of holes formed in a horizontal direction in each of two side portions exposed by the opening region;
• adsorbing an inhibitor to a surface of the substrate structure so that an adsorption density of the inhibitor on a surface outside of the plurality of holes is higher than an adsorption density on a surface inside of the plurality of holes by performing a process for adsorbing the inhibitor on the surface of the substrate structure in a deposition environment in which a gas diffusivity in the vertical direction is larger than a gas diffusivity in the horizontal direction;
• and
• performing a deposition process of a given material film on the surface inside of the plurality of holes and the surface outside of the plurality of holes, wherein a deposition rate of the material film varies according to the adsorption density of the inhibitor, and
• wherein the adsorbing and the performing are performed under a first pressure condition and a second pressure condition, respectively, and the pressure condition in a chamber under the second pressure condition is lower than the pressure condition in the chamber under the first pressure condition.