# US 12,604,670 B2 · In-package magnetic switching using glass core technology

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,604,670 B2
- Document ID: US12604670B2
- Status: Granted
- Kind: B2
- Application number: 17/349,653
- Filed: 2021-06-16
- Published: 2022-12-22
- Granted: 2026-04-14
- Earliest claimed: 2021-06-16
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Neelam Prabhu Gaunkar; Telesphor Kamgaing; Veronica Strong; Georgios C. Dogiamis; Aleksandar Aleksov
- Web page: https://patentgrep.com/patent/US12604670B2

## CPC

- H10N 50/80: Constructional details
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H10B 61/00: Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10N 50/10: Magnetoresistive devices
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/635: {Through-vias}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/68: Shapes or dispositions thereof
- H10W 70/692: Ceramics or glasses
- H10W 44/248: {for antennas}
- H10W 70/685: comprising multiple insulating layers
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10B: ELECTRONIC MEMORY DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments disclosed herein comprise package substrates and methods of forming such package substrates. In an embodiment, a package substrate comprises a core, where the core comprises glass. In an embodiment, an opening if formed through the core. In an embodiment, a magnetic region is disposed in the opening.

## Claims

### Claim 1

A package substrate, comprising:
a core, wherein the core comprises glass;
an opening through the core, wherein the opening has an hourglass shaped cross-section;
a magnetic region disposed in the opening; and
an unfilled opening in the core, the unfilled opening laterally spaced apart from the magnetic region in the opening.

### Claim 2 (depends on 1)

The package substrate of claim 1, wherein the magnetic region comprises a first magnetic layer and a second magnetic layer, wherein the first magnetic layer is spaced away from the second magnetic layer by a barrier layer.

### Claim 3 (depends on 2)

The package substrate of claim 2, wherein the first magnetic layer is a pinned ferromagnet, and wherein the second magnetic layer is an unpinned ferromagnet.

### Claim 4 (depends on 1)

The package substrate of claim 1, wherein a first barrier layer is above the magnetic region, and wherein a second barrier layer is below the magnetic region.

### Claim 5 (depends on 4)

The package substrate of claim 4, further comprising:
a conductive trace embedded in the glass core adjacent to the magnetic region.

### Claim 6 (depends on 4)

The package substrate of claim 4, wherein at least one surface of the conductive trace is contacted by a material other than the glass core.

### Claim 7 (depends on 1)

The package substrate of claim 1, wherein the unfilled opening is a channel configured for flowing a coolant is adjacent to the opening.

### Claim 8

An electronic package, comprising:
a core;
a buildup layer over the core;
a plurality of openings through the core, wherein each of the plurality of openings has an hourglass shaped cross-section;
a plurality of magnetic tunnel junctions (MTJs) in corresponding ones of the openings in the core, wherein the plurality of MTJs are coupled to each other to form a memory cell; and
an unfilled opening in the core, the unfilled opening laterally spaced apart from the plurality of MTJs in the plurality of openings.

### Claim 9 (depends on 8)

The electronic package of claim 8, wherein each MTJ of the plurality of MTJs comprises:
a first magnetic layer in the opening;
a barrier layer under the first magnetic layer in the opening; and
a second magnetic layer under the barrier layer in the opening.

### Claim 10 (depends on 9)

The electronic package of claim 9, wherein the first magnetic layer is a pinned ferromagnet, and wherein the second magnetic layer is an unpinned ferromagnet.

### Claim 11 (depends on 10)

The electronic package of claim 10, wherein a low resistance state through the MTJ occurs when the unpinned ferromagnet and the pinned ferromagnet have parallel magnetisms, and wherein a high resistance state through the MTJ occurs when the unpinned ferromagnet and the pinned ferromagnet have antiparallel magnetisms.

### Claim 12 (depends on 11)

The electronic package of claim 11, wherein the low resistance state is a binary logic 1 and wherein the high resistance state is a binary logic 0.

### Claim 13

An electronic package, comprising:
a core;
a buildup layer over the core;
a magnetic switch embedded in the core, wherein the magnetic switch comprises:
an opening through the core, wherein the opening has an hourglass shaped cross-section;
a first barrier layer in the opening;
a magnetic layer below the first barrier in the opening;
a second barrier layer below the magnetic layer in the opening; and
a conductive trace adjacent to the magnetic layer; and
an unfilled opening in the core, the unfilled opening laterally spaced apart from the opening of the magnetic switch.

### Claim 14 (depends on 13)

The electronic package of claim 13, wherein flowing current through the conductive trace aligns a magnetism in the magnetic layer to allow electrical conduction through the magnetic layer.

### Claim 15 (depends on 13)

The electronic package of claim 13, wherein the conductive trace has a trapezoidal cross-section.

### Claim 16 (depends on 15)

The electronic package of claim 15, wherein a surface of the conductive trace is covered by a material other than the core.

### Claim 17 (depends on 13)

The electronic package of claim 13, wherein the magnetic switch is coupled to an antenna.

### Claim 18 (depends on 17)

The electronic package of claim 17, wherein the magnetic switch allows for propagation of signals from the antenna to a die when current is flowing in a first direction in the conductive trace, and for propagation of signals from the die to the antenna when current is flowing in a second direction in the conductive trace.

### Claim 19 (depends on 13)

The electronic package of claim 13, further comprising a plurality of magnetic switches.

### Claim 20 (depends on 19)

The electronic package of claim 19, wherein the plurality of magnet switches are each coupled to a single die at first ends of the plurality of magnets, and wherein second ends of the plurality of magnetic switches are each coupled to different devices.

### Claim 21

An electronic system, comprising:
a board;
a package substrate coupled to the board, wherein the package substrate comprises:
a core;
a buildup layer over the core;
an opening through the core, wherein the opening has an hourglass shaped cross-section; and
a magnetic region disposed in the opening;
an unfilled opening in the core, the unfilled opening laterally spaced apart from the magnetic region in the opening a die coupled to the package substrate.

### Claim 22 (depends on 21)

The electronic package of claim 21, wherein the magnetic region is between a pair of barrier layers.

### Claim 23 (depends on 21)

The electronic package of claim 21, wherein the magnetic region comprises:
a first magnetic layer that is a pinned ferromagnet;
a barrier layer; and
a second magnetic layer that is an unpinned ferromagnet.

### Claim 24

A package substrate, comprising:
a core, wherein the core comprises glass;
an opening through the core; and
a magnetic region disposed in the opening, wherein a channel configured for flowing a coolant is adjacent to the opening.