# US 12,604,584 B2 · Liquid metal alloys in a light-emitting diode device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,584 B2 - Document ID: US12604584B2 - Status: Granted - Kind: B2 - Application number: 17/943,556 - Filed: 2022-09-13 - Published: 2024-03-14 - Granted: 2026-04-14 - Earliest claimed: 2022-09-13 - Assignees: CreeLED, Inc. - Applicants: CreeLED, Inc. - Inventors: Derek Miller; Ryan Zienert; Colin Blakely - Web page: https://patentgrep.com/patent/US12604584B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8583: {not being in contact with the bodies} - H10H 20/852: Encapsulations - H10W 90/00: Package configurations - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure relates to techniques for providing a liquid metal alloy in a light-emitting diode device that can both heal cracks formed in solder joints on the light-emitting diode (LED) device as well as improve thermal energy dissipation from the LED chips to improve the performance, reduce wear, and prolong the life of the LED chips. In an embodiment, a light-emitting diode device can include a liquid metal alloy containing gallium next to a solder joint, and when one or more cracks form, the liquid metal alloy can enter the cracks and solidify, healing the cracks. The liquid metal alloy can also be placed adjacent to, and in contact with the LED chip to transfer energy away from the LED chips. ## Claims ### Claim 1 A light-emitting diode device, comprising: a printed circuit board (PCB); a light-emitting diode package attached to the PCB via a solder joint; and a liquid metal alloy abutting the light-emitting diode package and the solder joint, wherein the liquid metal alloy is liquid at room temperature. ### Claim 2 (depends on 1) The light-emitting diode device of claim 1, wherein the liquid metal alloy comprises gallium. ### Claim 3 (depends on 2) The light-emitting diode device of claim 2, wherein the liquid metal alloy is configured to fill a crack formed in the solder joint, and the gallium in the liquid metal alloy diffuses into a material of the solder joint, resulting in an increased melting point of the liquid metal alloy. ### Claim 4 (depends on 3) The light-emitting diode device of claim 3, wherein in response to the increased melting point of the liquid metal alloy, the liquid metal alloy solidifies at room temperature. ### Claim 5 (depends on 1) The light-emitting diode device of claim 1, further comprising: a heatsink abutting the liquid metal alloy, wherein the heatsink dissipates thermal energy from the light-emitting diode package received via the liquid metal alloy. ### Claim 6 (depends on 5) The light-emitting diode device of claim 5, wherein the heatsink is above the PCB, and lateral to the light-emitting diode package. ### Claim 7 (depends on 5) The light-emitting diode device of claim 5, wherein the heatsink is integrated into the PCB. ### Claim 8 (depends on 1) The light-emitting diode device of claim 1, further comprising: a substrate material on a surface of the PCB that surrounds the liquid metal alloy, wherein the substrate material has an anti-wetting surface that repels the liquid metal alloy. ### Claim 9 (depends on 1) The light-emitting diode device of claim 1, further comprising: a solder mask layer in between the liquid metal alloy and the PCB. ### Claim 10 (depends on 9) The light-emitting diode device of claim 9, further comprising: a transparent encapsulating layer that encapsulates the solder mask, the liquid metal alloy and the light-emitting diode package. ### Claim 11 A light-emitting diode device, comprising: a printed circuit board (PCB); a light-emitting diode package attached to the PCB via a solder joint; and a liquid metal alloy abutting the light-emitting diode package, wherein the liquid metal alloy is liquid at room temperature. ### Claim 12 (depends on 11) The light-emitting diode device of claim 11, further comprising: a heatsink abutting the liquid metal alloy, wherein the heatsink dissipates thermal energy from the light-emitting diode package received via the liquid metal alloy. ### Claim 13 (depends on 11) The light-emitting diode device of claim 11, further comprising a dielectric barrier that separates the liquid metal alloy from the solder joint. ### Claim 14 (depends on 11) The light-emitting diode device of claim 11, further comprising: a transparent encapsulating layer that encapsulates the liquid metal alloy and light-emitting diode package. ### Claim 15 (depends on 11) The light-emitting diode device of claim 11, further comprising: a substrate material on a surface of the PCB that surrounds the liquid metal alloy, wherein the substrate material has an anti-wetting surface that repels the liquid metal alloy. ### Claim 16 A light-emitting diode device, comprising: a printed circuit board (PCB); a light-emitting diode package attached to the PCB via a solder joint; and a liquid metal alloy comprising gallium, wherein the liquid metal alloy is configured to fill a crack formed in the solder joint, and then subsequently solidify, wherein the liquid metal alloy is separated from a material of the solder joint by a barrier material that prevents the liquid metal alloy from contacting the material of the solder joint until the crack is formed. ### Claim 17 (depends on 16) The light-emitting diode device of claim 16, wherein the liquid metal alloy solidifies in response to the gallium in the liquid metal alloy diffusing into the material of the solder joint resulting in a reduced melting point of the liquid metal alloy. ### Claim 18 (depends on 16) The light-emitting diode device of claim 16, wherein the liquid metal alloy is encapsulated by the barrier material in pockets spread through the material of the solder joint. ### Claim 19 (depends on 16) The light-emitting diode device of claim 16, wherein the liquid metal alloy is in a reservoir adjacent to the solder joint.