# US 12,604,577 B2 · Micro-LED encapsulated structure including two polymeric layers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,577 B2 - Document ID: US12604577B2 - Status: Granted - Kind: B2 - Application number: 17/968,401 - Filed: 2022-10-18 - Published: 2024-04-18 - Granted: 2026-04-14 - Earliest claimed: 2022-10-18 - Assignees: GM Global Technology Operations LLC - Applicants: GM Global Technology Operations LLC - Inventors: Bradley Allen Newcomb; Thomas S. Prevost; Julien P. Mourou - Web page: https://patentgrep.com/patent/US12604577B2 ## CPC - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/01: Manufacture or treatment - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A micro-LED encapsulated structure comprising a plurality of micro-LEDs and interconnections arranged on a supporting layer. A first polymer layer includes a first polymer matrix encapsulating the plurality of micro-LEDs, the interconnections, and the supporting layer. A second polymer layer includes a second polymer matrix encapsulating at least one side of the first polymer layer. ## Claims ### Claim 1 A micro-LED encapsulated structure comprising: a plurality of micro-LEDs and interconnections arranged on a supporting layer; a first polymer layer including a first polymer matrix encapsulating the plurality of micro-LEDs, the interconnections, and the supporting layer, wherein the first polymer layer encapsulates a plurality of sides of each of the plurality of micro-LEDs; reinforcing fibers are arranged on the first polymer layer; and a second polymer layer including a second polymer matrix encapsulating idea plurality of sides of the first polymer layer, wherein the second polymer layer encapsulates the first polymer layer and the reinforcing fibers. ### Claim 2 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the supporting layer is made of a third polymer matrix; and the third polymer matrix of the supporting layer and the first polymer matrix of the first polymer layer are the same. ### Claim 3 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the first polymer matrix is selected from a group consisting of a thermoset polymer, a thermoplastic polymer, an elastomer, or a vitrimer; and the second polymer matrix is selected from a group consisting of a thermoset polymer, a thermoplastic polymer, an elastomer, or a vitrimer. ### Claim 4 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the supporting layer is made using a different polymer matrix than the first polymer layer; and the first polymer matrix and the second polymer matrix are the same. ### Claim 5 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the supporting layer is made using a different polymer matrix than the first polymer layer; and the first polymer matrix and the second polymer matrix are different. ### Claim 6 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein the first polymer layer and the second polymer layer have different opacity. ### Claim 7 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein the first polymer layer and the second polymer layer are transparent. ### Claim 8 (depends on 1) The micro-LED encapsulated structure of claim 1, further comprising: at least one of reinforcing fibers and fiber tow arranged on the supporting layer; and the first polymer layer encapsulates the plurality of micro-LEDs, the interconnections, the at least one of reinforcing fibers and fiber tow, and the supporting layer. ### Claim 9 (depends on 8) The micro-LED encapsulated structure of claim 8, wherein the reinforcing fibers are attached to the supporting layer. ### Claim 10 (depends on 8) The micro-LED encapsulated structure of claim 8, wherein the reinforcing fibers are infused with a polymer matrix. ### Claim 11 (depends on 8) The micro-LED encapsulated structure of claim 8, wherein the reinforcing fibers comprise a structural fiber and a thermoplastic fiber that are consolidated under temperature and/or pressure prior to the encapsulating with the first polymer matrix. ### Claim 12 (depends on 8) The micro-LED encapsulated structure of claim 8, wherein the reinforcing fibers include a partially cured thermoset resin. ### Claim 13 (depends on 8) The micro-LED encapsulated structure of claim 8, wherein the reinforcing fibers are arranged on an outer surface of the first polymer layer after the first polymer layer is formed and are not encapsulated in the first polymer layer. ### Claim 14 A method for manufacturing a micro-LED encapsulated structure, comprising: providing a plurality of micro-LEDs and interconnections arranged on a supporting layer; encapsulating the plurality of micro-LEDs, the interconnections, and the supporting layer in a first polymer layer including a first polymer matrix, wherein the first polymer layer encapsulates a plurality of sides of each of the plurality of micro-LEDs; applying reinforcing fibers on the first polymer layer subsequent to curing of the first polymer layer; and encapsulating a plurality of sides of the first polymer layer and the reinforcing fibers in a second polymer layer, wherein the second polymer layer includes a second polymer matrix, wherein the first polymer matrix is one of transparent or opaque and the second polymer matrix is transparent. ### Claim 15 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the plurality of micro-LEDs are arranged in the first polymer layer and direct light towards the second polymer layer; the first polymer layer and the second polymer layer are transparent; and light emitted from the plurality of micro-LEDS passes through the first polymer layer and the second polymer layer. ### Claim 16 (depends on 15) The micro-LED encapsulated structure of claim 15, wherein each of the plurality of micro-LEDs comprises a first side contacting the supporting layer and other sides encapsulated in the first polymer layer. ### Claim 17 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the plurality of micro-LEDs are arranged in the first polymer layer and direct light towards the second polymer layer; the first polymer layer is opaque; the second polymer layer is transparent; and light emitted from the plurality of micro-LEDs passes through the second polymer layer. ### Claim 18 (depends on 17) The micro-LED encapsulated structure of claim 17, wherein each of the plurality of micro-LEDs comprises a first side contacting the second polymer layer and other sides encapsulated in the first polymer layer. ### Claim 19 (depends on 1) The micro-LED encapsulated structure of claim 1, further comprising the supporting layer, wherein: the supporting layer is compatible with material of the first polymer layer; and the supporting layer is integrated with the first polymer layer during encapsulation of the supporting layer by the first polymer layer. ### Claim 20 (depends on 1) The micro-LED encapsulated structure of claim 1, wherein: the plurality of micro-LEDs, the reinforcing fibers, and the interconnections are over-molded in the first polymer layer; and the second polymer layer is over-molded over an outer surface of the first polymer layer.