# US 12,604,574 B2 · Light source module and backlight unit having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,574 B2 - Document ID: US12604574B2 - Status: Granted - Kind: B2 - Application number: 18/940,660 - Filed: 2024-11-07 - Published: 2025-02-20 - Granted: 2026-04-14 - Earliest claimed: 2013-05-09 - Assignees: Seoul Semiconductor Co., Ltd. - Applicants: Seoul Semiconductor Co., Ltd. - Inventors: Young Jun Song; Da Hye Kim; Seoung Ho Jung - Web page: https://patentgrep.com/patent/US12604574B2 ## CPC - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - G02B 6/0073: {Light emitting diode [LED]} - H10H 20/856: Reflecting means - G02F 1/133614: {using photoluminescence, e.g. phosphors illuminated by UV or blue light} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS ## Abstract A backlight unit includes one or more light sources operable to emit light and a light guide plate arranged adjacent to the one or more light sources, reflected lights exiting the one or more light sources via the second surfaces and entering the light guide plate. A light source includes a light emitting device having a substrate and a semiconductor stack disposed on the substrate. The reflector is structured and positioned to block light emitted from a first surface of the light emitting device by reflecting the light emitted from the first surface toward second surfaces of the light source. ## Claims ### Claim 1 A light emitting module, comprising: a circuit board; a light guide plate; a first light emitter disposed on the circuit board and operable to emit light, the first light emitter comprising: a first light source comprising a substrate and a semiconductor stack disposed on the substrate; a first reflector configured to reflect the light emitted from the semiconductor stack; and a first molding layer covering the first light source, a second light emitter disposed on the circuit board and operable to emit light, the second light emitter including: a second light source including a substrate and a semiconductor stack connected to the substrate; a second reflector configured to reflect light emitted from the semiconductor stack; and a second molding layer covering the second light source, wherein the first light emitter and the second light emitter are arranged side by side and spaced apart with a predetermined distance; wherein the light guide plate is arranged adjacent to the first light emitter and the second light emitter and includes an incident surface facing to the first light emitter and the second light emitter, wherein the substrate of the first light emitter includes a concave region covered by the first molding layer, wherein each of the first molding layer and the second molding layer includes a convex-concave light exit surface, and wherein the first reflector and the second reflector are separated from each other. ### Claim 2 (depends on 1) The light emitting module of claim 1, wherein a thickness of the first molding layer covering an upper surface of the first light source is different from a thickness of the first molding layer covering a side surface of the first light source. ### Claim 3 (depends on 1) The light emitting module of claim 1, wherein a thickness of the second molding layer covering an upper surface of the second light source is different from a thickness of the second molding layer covering a side surface of the second light source. ### Claim 4 (depends on 1) The light emitting module of claim 1, wherein the first light source further includes a first pad and a second pad electrically connected to the semiconductor stack of the first light source, and wherein the first pad and the second pad include same conductive materials. ### Claim 5 (depends on 1) The light emitting module of claim 1, further comprising a cover surrounding the first light emitter and the second light emitter. ### Claim 6 (depends on 1) The light emitting module of claim 1, wherein the semiconductor stack of the first light source includes a concave region. ### Claim 7 (depends on 1) The light emitting module of claim 1, wherein the semiconductor stack of the second light source includes a concave region. ### Claim 8 A light emitting module, comprising: a circuit board; light emitters disposed on the circuit board and operable to emit light, each light emitter including: a light source including a substrate and a semiconductor stack connected to the substrate; a reflector configured to reflect light emitted from the semiconductor stack from a first direction toward second direction; and a molding layer covering the light source; and a light guide plate arranged adjacent to the light emitters and including an incident surface facing to the light emitters, wherein at least one substrate of light sources includes a concave region covered by at least one of molding layers, wherein the light emitters are arranged side by side and spaced apart from each other, wherein each of the molding layers of the light emitters includes a convex-concave light exit surface, and wherein reflectors of the light emitters are separated from each other. ### Claim 9 (depends on 8) The light emitting module of claim 8, wherein a thickness of the molding layer of a first light emitter of the light emitters covering an upper surface of the light source is different from a thickness of the molding layer of the first light emitter covering a side surface of the light source. ### Claim 10 (depends on 8) The light emitting module of claim 8, wherein the each of the molding layers of the light emitters includes a region having non-uniform thickness. ### Claim 11 (depends on 8) The light emitting module of claim 8, wherein the light source further includes a first pad and a second pad electrically connected to the semiconductor stack of the light source, and wherein the first pad and the second pad include same conductive materials. ### Claim 12 (depends on 11) The light emitting module of claim 11, wherein the light source further includes an insulation disposed between the semiconductor stack and the second pad. ### Claim 13 (depends on 8) The light emitting module of claim 8, further comprising a cover surrounding the light emitters. ### Claim 14 (depends on 8) The light emitting module of claim 8, wherein semiconductor stacks of the light sources include a concave region. ### Claim 15 A light emitting module, comprising: a circuit board; light sources disposed on the circuit board and configured to emit light, each light source including: a substrate; a semiconductor stack disposed on the substrate; and a reflector configured to reflect light emitted from the semiconductor stack from a first direction toward second direction, a molding layer; and a light guide plate arranged adjacent to the light sources and configured to guide the light emitted from the light sources entering the light guide plate and including an incident surface facing to the light sources, wherein at least one substrate of the light sources includes a concave region covered by at least one of molding layers, wherein the light sources are arranged side by side and spaced apart from each other, wherein each of the molding layers of the light sources includes a convex-concave light exit surface, and wherein reflectors of the light sources are separated from each other. ### Claim 16 (depends on 15) The light emitting module of claim 15, wherein the each of the molding layers of the light sources includes a region having a non-uniform thickness. ### Claim 17 (depends on 15) The light emitting module of claim 15, wherein each of the light sources further includes a first pad and a second pad electrically connected to a semiconductor stack of a corresponding light source, and wherein the first pad and the second pad include same conductive materials. ### Claim 18 (depends on 17) The light emitting module of claim 17, wherein each of the light sources further includes an insulation disposed between the semiconductor stack and the second pad. ### Claim 19 (depends on 15) The light emitting module of claim 15, further comprising a cover surrounding the light sources. ### Claim 20 (depends on 15) The light emitting module of claim 15, wherein each of semiconductor stacks of the light sources includes a concave region.