# US 12,604,573 B2 · Device configured to bond an electronic component, method for bonding an electronic component, and method for manufacturing a light-emitting diode display

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- Number: US 12,604,573 B2
- Document ID: US12604573B2
- Status: Granted
- Kind: B2
- Application number: 18/340,894
- Filed: 2023-06-26
- Published: 2024-01-04
- Granted: 2026-04-14
- Earliest claimed: 2022-07-04
- Assignees: Micraft System Plus Co., Ltd.
- Applicants: Micraft System Plus Co., Ltd.
- Inventors: Chingju Lin; Sheng-Che Huang; Shao-Wei Huang
- Web page: https://patentgrep.com/patent/US12604573B2

## CPC

- H10H 20/8506: {Containers}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/01: Manufacture or treatment
- H10W 90/00: Package configurations
- H10H 20/0364: {of interconnections}
- H10W 72/072: {of bump connectors}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A device configured to bond an electronic component includes a carrying platform, a pressing element, a closed space generating mechanism, a gas extracting mechanism, and an energy generating mechanism. The carrying platform is configured to carry a target substrate and a carrying substrate carrying the electronic component on the target substrate. The pressing element is made of a flexible material. The closed space generating mechanism is capable of putting the pressing element onto the carrying platform, so as to form a closed space between the pressing element and the carrying platform. The gas extracting mechanism is configured to extract gas from the closed space. The energy generating mechanism is disposed near the carrying platform, and configured to generate energy toward the carrying platform. A method for bonding an electronic component and a method for manufacturing a light-emitting diode (LED) display are also provided.

## Claims

### Claim 1

A method for bonding an electronic component, comprising:
providing a carrying substrate having a surface on which the electronic component to be bonded is disposed;
providing a target substrate having a bonding surface;
arranging the carrying substrate and the target substrate in a way that the carrying substrate faces the target substrate and the electronic component to be bonded is in contact with the bonding surface of the target substrate;
enclosing the carrying substrate and the target substrate thus arranged in a closed space which is formed by an elastomer;
generating a negative pressure in the closed space, thereby making the elastomer press on either the carrying substrate or the target substrate of the carrying substrate and the target substrate thus arranged; and
applying an energy beam onto the carrying substrate or the target substrate to bond the electronic component on the target substrate from the carrying substrate.

### Claim 2 (depends on 1)

The method according to claim 1, further comprising providing a solder on either the electronic component to be bonded or the bonding surface of the target substrate, prior to applying the energy beam.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the energy beam is a laser beam.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the energy beam is applied to travel through the carrying substrate.

### Claim 5 (depends on 4)

The method according to claim 4, wherein the elastomer is made by the negative pressure to press on the carrying substrate.

### Claim 6 (depends on 4)

The method according to claim 4, wherein the elastomer is made by the negative pressure to press on the target substrate.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the electronic component is a light-emitting diode (LED) chip.

### Claim 8 (depends on 7)

A method for manufacturing an LED display, comprising using the method according to claim 7 to bond the LED chip.