# US 12,604,561 B2 · Mixed color light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,561 B2 - Document ID: US12604561B2 - Status: Granted - Kind: B2 - Application number: 17/540,047 - Filed: 2021-12-01 - Published: 2022-06-09 - Granted: 2026-04-14 - Earliest claimed: 2020-12-04 - Assignees: Seoul Viosys Co., Ltd. - Applicants: Seoul Viosys Co., Ltd. - Inventors: Chung Hoon Lee - Web page: https://patentgrep.com/patent/US12604561B2 ## CPC - H10H 20/812: within the light-emitting regions, e.g. having quantum confinement structures - H10H 20/018: {Bonding of wafers} - H10H 20/821: of the light-emitting regions, e.g. non-planar junctions - H10H 20/8312: {extending at least partially through the bodies} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/14: comprising multiple light-emitting semiconductor components - H10W 90/00: Package configurations - H10H 20/032: {of electrodes} - H10H 20/0364: {of interconnections} - H10H 20/825: containing nitrogen, e.g. GaN - H10H 20/8512: {Wavelength conversion materials} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light emitting device including a first semiconductor stacked structure configured to emit multi-color light, and a red light source configured to emit red light, in which the first semiconductor stacked structure includes a first conductivity-type nitride semiconductor layer, an active layer disposed on the first conductivity-type nitride semiconductor layer, and a second conductivity-type nitride semiconductor layer disposed on the active layer, the active layer has a multi-quantum well structure including a plurality of barrier layers and a plurality of well layers stacked one over another, and the active layer is configured to emit multi-color light. ## Claims ### Claim 1 A light emitting device, comprising: a first semiconductor configured to emit multi-band spectral light; and a red light source configured to emit red light, wherein the first semiconductor comprises: a first conductivity-type nitride semiconductor layer; an active layer disposed on the first conductivity-type nitride semiconductor layer; and a second conductivity-type nitride semiconductor layer disposed on the active layer, wherein the active layer includes a multi-quantum well structure including a plurality of barrier layers, a plurality of well layers, and a plurality of capping layers alternately stacked one over another, wherein the plurality of well layers includes a first well layer and a second well layer, and the plurality of capping layers includes a first capping layer and a second capping layer, wherein the first capping layer is disposed on a top surface of the first well layer, and the second capping layer is disposed on a top surface of the second well layer, wherein an Al composition of a first portion of the plurality of capping layers is greater than an Al composition of a second portion of the plurality of capping layers, wherein a region of the active layer includes a V-pit structure, wherein the first portion of the plurality of capping layers is disposed over a flat surface of the V-pit structure, wherein the second portion of the plurality of capping layers is disposed in the V-pit structure, and wherein the active layer is configured to emit the multi-band spectral light. ### Claim 2 (depends on 1) The light emitting device of claim 1, wherein the red light source includes a phosphor configured to convert a wavelength of light emitted from the first semiconductor into red light. ### Claim 3 (depends on 2) The light emitting device of claim 2, further comprising a printed circuit board, wherein the first semiconductor is disposed on the printed circuit board. ### Claim 4 (depends on 3) The light emitting device of claim 3, wherein both of the first semiconductor and the phosphor are disposed at each of a plurality of locations on the printed circuit board. ### Claim 5 (depends on 1) The light emitting device of claim 1, wherein the red light source includes a second semiconductor configured to emit red light. ### Claim 6 (depends on 5) The light emitting device of claim 5, wherein the second semiconductor is spaced apart from the first semiconductor in a lateral direction. ### Claim 7 (depends on 6) The light emitting device of claim 6, further comprising a printed circuit board, wherein both of the first semiconductor and the second semiconductor are disposed at each of a plurality of locations on the printed circuit board. ### Claim 8 (depends on 5) The light emitting device of claim 5, wherein the second semiconductor is coupled to the first semiconductor by a coupling layer. ### Claim 9 (depends on 8) The light emitting device of claim 8, further comprising a substrate disposed on a side of the first semiconductor, wherein the multi-band spectral light generated from the first semiconductor and the red light generated from the second semiconductor are configured to be emitted to the outside of the light emitting device through the substrate. ### Claim 10 (depends on 9) The light emitting device of claim 9, wherein the first semiconductor and the second semiconductor are bonded by the coupling layer, and the coupling layer comprises an insulation layer or a transparent electrode. ### Claim 11 (depends on 10) The light emitting device of claim 10, further comprising: a first bonding pad commonly electrically connected to the first semiconductor and the second semiconductor; and a second bonding pad and a third bonding pad electrically connected to the first semiconductor and the second semiconductor, respectively. ### Claim 12 (depends on 11) The light emitting device of claim 11, wherein: the second semiconductor includes a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer; the first bonding pad is commonly electrically connected to the first conductivity-type nitride semiconductor layer of the first semiconductor and the first conductivity-type semiconductor layer of the second semiconductor; the second bonding pad is electrically connected to the second conductivity-type nitride semiconductor layer of the first semiconductor; and the third bonding pad is electrically connected to the second conductivity-type semiconductor layer of the second semiconductor. ### Claim 13 (depends on 12) The light emitting device of claim 12, further comprising buried vias electrically connecting the first, second, and third bonding pads to the first conductivity-type nitride semiconductor layer, the first conductivity-type semiconductor layer, the second conductivity-type nitride semiconductor layer, and the second conductivity-type semiconductor layer. ### Claim 14 (depends on 1) The light emitting device of claim 1, wherein the multi-band spectral light includes blue light and yellow light.