# US 12,604,555 B2 · Imaging device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,555 B2 - Document ID: US12604555B2 - Status: Granted - Kind: B2 - Application number: 18/214,138 - Filed: 2023-06-26 - Published: 2023-10-19 - Granted: 2026-04-14 - Earliest claimed: 2018-06-15 - Assignees: Sony Semiconductor Solutions Corporation - Applicants: Sony Semiconductor Solutions Corporation - Inventors: Yoshiaki Masuda; Tokihisa Kaneguchi - Web page: https://patentgrep.com/patent/US12604555B2 ## CPC - H10F 39/811: {Interconnections} - H04N 25/70: SSIS architectures; Circuits associated therewith - H10F 39/182: {Colour image sensors} - H10F 39/199: {Back-illuminated image sensors} - H10F 39/802: {Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes} - H10F 39/804: {Containers or encapsulations} - H10F 39/8053: {Colour filters} - H10F 39/8063: {Microlenses} - H10F 39/809: {of hybrid image sensors} - H10W 20/01: {Manufacture or treatment} - H10W 20/48: Insulating materials thereof - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An imaging device including: a photoelectric converter; a protection member provided on a light incidence side of the photoelectric converter; a substrate opposed to the protection member with the photoelectric converter interposed therebetween and having a first surface on the photoelectric converter side and a second surface opposed to the first surface; a rewiring layer provided in a selective region of the second surface of the substrate; and a protective resin layer provided on the second surface of the substrate, the second surface of the substrate having an external terminal coupling region exposed from the protective resin layer, and a stress relaxation region exposed from the protective resin layer and disposed at a position different from the external terminal coupling region. ## Claims ### Claim 1 An imaging device, comprising: a photoelectric converter; a protection member provided on a light incident side of the photoelectric converter; a substrate opposed to the protection member with the photoelectric converter interposed therebetween and having a first surface on the photoelectric converter side and a second surface opposed to the first surface; a rewiring layer provided in a selective region of the second surface of the substrate; and a protective resin layer provided on the second surface of the substrate, wherein the second surface of the substrate has: a first external terminal coupling region exposed from the protective resin layer, a second external terminal coupling region exposed from the protective resin layer, and a stress relaxation region exposed from the protective resin layer and disposed at a position different from the first external terminal coupling region, wherein the stress relaxation region includes the rewiring layer, and wherein the stress relaxation region is disposed between the first external terminal coupling region and the second external terminal coupling region. ### Claim 2 (depends on 1) The imaging device according to claim 1, further comprising a first external terminal provided on the second surface of the substrate, wherein, in the first external terminal coupling region, the first external terminal is exposed from the protective resin layer. ### Claim 3 (depends on 2) The imaging device according to claim 2, wherein the protective resin layer surrounds the first external terminal. ### Claim 4 (depends on 2) The imaging device according to claim 2, further comprising a second external terminal provided on the second surface of the substrate, wherein, in the second external terminal coupling region, the second external terminal is exposed from the protective resin layer. ### Claim 5 (depends on 4) The imaging device according to claim 4, wherein the protective resin layer surrounds the second external terminal. ### Claim 6 (depends on 5) The imaging device according to claim 5, wherein a region other than a region in which the protective resin layer is provided to surround the second external terminal includes the first and second external terminal coupling regions or the stress relaxation region. ### Claim 7 (depends on 1) The imaging device according to claim 1, wherein the stress relaxation region does not overlap the rewiring layer. ### Claim 8 (depends on 1) The imaging device according to claim 1, wherein the second surface of the substrate further has a narrow pitch region in which rewiring layers adjacent to each other are disposed at a predetermined interval, and a wide pitch region in which rewiring layers adjacent to each other are disposed at an interval larger than the interval in the narrow pitch region. ### Claim 9 (depends on 8) The imaging device according to claim 8, wherein the protective resin layer is provided in the narrow pitch region, and wherein the stress relaxation region is disposed at a position overlapping the wide pitch region. ### Claim 10 (depends on 9) The imaging device according to claim 9, wherein the protective resin layer is provided between the rewiring layers adjacent to each other in the narrow pitch region, and wherein the stress relaxation region is also disposed at a position overlapping the rewiring layers in the narrow pitch region. ### Claim 11 (depends on 1) The imaging device according to claim 1, further comprising: a first chip provided with the photoelectric converter; and a second chip including the substrate. ### Claim 12 (depends on 11) The imaging device according to claim 11, further comprising a third chip provided between the first chip and the second chip. ### Claim 13 (depends on 1) The imaging device according to claim 1, wherein the rewiring layer includes copper. ### Claim 14 (depends on 1) The imaging device according to claim 1, wherein the substrate includes a silicon substrate.