# US 12,604,549 B2 · Semiconductor image-sensing structure and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,549 B2 - Document ID: US12604549B2 - Status: Granted - Kind: B2 - Application number: 17/818,387 - Filed: 2022-08-09 - Published: 2024-02-15 - Granted: 2026-04-14 - Earliest claimed: 2022-08-09 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company Ltd. - Inventors: Ming-Hsien Yang; Chun-Liang Lu; Chun-Hao Chou; Kuo-Cheng Lee - Web page: https://patentgrep.com/patent/US12604549B2 ## CPC - H10F 39/805: {Coatings} - H10F 39/014: {of CMOS image sensors} - H10F 39/024: {of coatings or optical elements} - H10F 39/182: {Colour image sensors} - H10F 39/8053: {Colour filters} - H10F 39/8063: {Microlenses} - H10F 39/807: {Pixel isolation structures} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A semiconductor image sensing structure includes a substrate, an isolation structure, an anti-reflection structure, at least one optical element and a transistor. The substrate has at least one photodiode region. The isolation structure is disposed in the substrate and surrounds the photodiode region. The anti-reflection structure covers the photodiode region. The optical element is disposed over the anti-reflection structure and corresponds to the photodiode region. The transistor is disposed under the photodiode region. ## Claims ### Claim 1 A semiconductor image-sensing structure, comprising: a substrate having at least one photodiode region; an isolation structure disposed in the substrate and surrounding the at least one photodiode region; an anti-reflection structure covering the photodiode region; at least one optical element disposed over the anti-reflection structure and corresponding to the at least one photodiode region; a base grid disposed above a top of the isolation structure, wherein a protecting layer that is formed between the anti-reflection structure and the at least one optical element encloses the base grid; and a transistor disposed under the at least one photodiode region. ### Claim 2 (depends on 1) The semiconductor image-sensing structure of claim 1, wherein the anti-reflection structure includes a plurality of pillars. ### Claim 3 (depends on 2) The semiconductor image-sensing structure of claim 2, wherein the substrate defines a plurality of recesses over the at least one photodiode region to form the plurality of pillars. ### Claim 4 (depends on 2) The semiconductor image-sensing structure of claim 2, further comprising a material covering the anti-reflection structure, wherein the material includes a base film and a main portion, the base film is conformal with the plurality of pillars, and the main portion is disposed on the base film. ### Claim 5 (depends on 4) The semiconductor image-sensing structure of claim 4, wherein the base film includes a first layer disposed over the plurality of pillars, a second layer disposed over the first layer and a third layer disposed over the second layer. ### Claim 6 (depends on 5) The semiconductor image-sensing structure of claim 5, wherein the first layer includes Al2O3, the second layer includes HfO, and the third layer includes Ta2O5. ### Claim 7 (depends on 4) The semiconductor image-sensing structure of claim 4, wherein the main portion includes silicon oxide or tungsten. ### Claim 8 (depends on 4) The semiconductor image-sensing structure of claim 4, wherein the isolation structure includes a plurality of deep trench isolations (DTIs), and the plurality of deep trench isolations (DTIs) include a portion of the material. ### Claim 9 (depends on 1) The semiconductor image-sensing structure of claim 1, wherein the isolation structure includes a plurality of deep trench isolations (DTIs), a plurality of ion implantation regions and a plurality of shallow trench isolations (STIs) connecting to one and another. ### Claim 10 (depends on 1) The semiconductor image-sensing structure of claim 1, further comprising a grid structure disposed over the anti-reflection structure and aligned with the isolation structure, wherein the grid structure includes the base grid and a dielectric grid over the base grid. ### Claim 11 (depends on 10) The semiconductor image-sensing structure of claim 10, wherein the at least one optical element includes at least one color filter disposed over the anti-reflection structure and surrounded by the grid structure. ### Claim 12 A semiconductor image-sensing structure, comprising: a substrate having at least one photodiode region; an isolation structure disposed in the substrate and surrounding the at least one photodiode region; at least one optical element disposed over the substrate and corresponding to the at least one photodiode region; a plurality of pillars disposed between the at least one photodiode region and the at least one optical element, wherein the plurality of pillars are configured to reduce a reflection of a light from the at least one optical element; and a base grid disposed over the anti-reflection structure, wherein a protecting layer is formed between the at least one optical element and the plurality of pillars, and the protecting layer covers a top surface and sidewalls of the base grid. ### Claim 13 (depends on 12) The semiconductor image-sensing structure of claim 12, wherein a pitch between the plurality of pillars is less than a wavelength of the light from the at least one optical element. ### Claim 14 (depends on 12) The semiconductor image-sensing structure of claim 12, wherein the at least one optical element includes a first optical element and a second optical element, the plurality of pillars include a plurality of first pillars under the first optical element and a plurality of second pillars under the second optical element, wherein a number of the first pillars is different from a number of the second pillars. ### Claim 15 (depends on 14) The semiconductor image-sensing structure of claim 14, wherein a pitch between the first pillars is different from a pitch between the second pillars. ### Claim 16 (depends on 12) The semiconductor image-sensing structure of claim 12, wherein a shape of a cross section of each of the plurality of pillars includes one of a square, a rectangle, and a triangle. ### Claim 17 A method of manufacturing a semiconductor image-sensing structure, comprising: patterning a surface of a substrate to form a plurality of pillars; forming an isolation structure in the substrate, wherein the isolation structure surrounds at least one photodiode region in the substrate, and the plurality of pillars are disposed over the at least one photodiode region; forming a base grid disposed above a top of the isolation structure; forming a protecting layer above the plurality of pillars and atop the base grid to cover the base grid; and forming at least one optical element on the protecting layer, wherein the at least one optical element is positioned over the plurality of pillars and corresponding to the at least one photodiode region. ### Claim 18 (depends on 17) The method of claim 17, wherein forming the isolation structure and the plurality of pillars includes: forming a trench and a plurality of recesses in the substrate, wherein the trench surrounds the at least one photodiode region, and the recesses define the plurality of pillars; and forming a material to cover the plurality of pillars, wherein a portion of the material fills the trench to form the isolation structure. ### Claim 19 (depends on 18) The method of claim 18, further comprising: forming a grid structure over the material and aligned with the isolation structure, wherein the grid structure includes the base grid and a dielectric grid over the base grid. ### Claim 20 (depends on 19) The method of claim 19, further comprising: forming the at least one optical element in a space defined by the grid structure.