# US 12,604,548 B2 · Reduced-height image-capturing module

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- Number: US 12,604,548 B2
- Document ID: US12604548B2
- Status: Granted
- Kind: B2
- Application number: 18/212,230
- Filed: 2023-06-21
- Published: 2024-09-12
- Granted: 2026-04-14
- Earliest claimed: 2023-03-08
- Assignees: Bison Electronics Inc.
- Applicants: Bison Electronics Inc.
- Inventors: Shun-Chou Cheng; Li-Ying Chen
- Web page: https://patentgrep.com/patent/US12604548B2

## CPC

- H10F 39/804: {Containers or encapsulations}
- G02B 7/006: {Filter holders}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 39/811: {Interconnections}
- H10W 72/50: Bond wires
- H10W 72/90: Bond pads, in general
- H10W 72/59: Bond pads specially adapted therefor
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention provides a reduced-height image-capturing module, which includes a lens assembly, an image-sensing chip, a carrier base and a circuit substrate. The carrier base has a base body, two extending plate bodies extending and a base groove recessed. A lower portion of the base body enters a through opening of the circuit substrate, and the two extending plate bodies cross over the through opening of the circuit substrate and are disposed on an upper surface of the circuit substrate. The image-sensing chip is disposed on a recessed bottom surface of the base groove which is not at the same level as the upper surface of the circuit substrate, so that the recessed bottom surface is lower than the upper surface of the circuit substrate. The lens assembly is disposed on the upper portion of the base body and corresponds to the image-sensing chip.

## Claims

### Claim 1

A reduced-height image-capturing module, comprising:
a lens assembly;
an image-sensing chip;
a carrier base; and
a circuit substrate;
wherein the circuit substrate has a through opening;
wherein the carrier base has a base body, two extending plate bodies extending laterally outward from an upper portion of the base body, and a base groove recessed downward from the upper portion of the base body of the carrier base;
wherein a lower portion of the base body is configured to enter the through opening of the circuit substrate, and the two extending plate bodies cross over the through opening of the circuit substrate and are disposed on an upper surface of the circuit substrate;
wherein the image-sensing chip is disposed on a recessed bottom surface of the base groove of the base body of the carrier base, and the recessed bottom surface of the base groove and the upper surface of the circuit substrate are not at a same level, so that the recessed bottom surface of the base groove is lower than the upper surface of the circuit substrate;
wherein the lens assembly is disposed on the upper portion of the base body and corresponds to the image-sensing chip.

### Claim 2 (depends on 1)

The reduced-height image-capturing module according to claim 1, wherein the lens assembly includes a lens holder disposed on the upper portion of the base body and a lens structure carried by the lens holder, and the lens structure corresponds to a photosensitive surface of the image-sensing chip.

### Claim 3 (depends on 2)

The reduced-height image-capturing module according to claim 2, further comprising a filter disposed between the image-sensing chip and the lens structure.

### Claim 4 (depends on 3)

The reduced-height image-capturing module according to claim 3, wherein the base groove of the carrier base is a stepped groove, and the base groove includes a first groove and a second groove formed under the first groove and communicated with the first groove; wherein a projection area of the first groove is greater than a projection area of the second groove, and a projection area of the filter is greater than the projection area of the second groove and less than the projection area of the first groove, so that the filter is accommodated in the first groove of the base groove, and the image-sensing chip is accommodated in the second groove of the base groove.

### Claim 5 (depends on 1)

The reduced-height image-capturing module according to claim 1, wherein the image-sensing chip includes a plurality of chip metal pads disposed around a photosensitive surface thereof, and the carrier base includes a plurality of recessed metal pads disposed on the recessed bottom surface of the base groove, and the chip metal pads are electrically connected to the recessed metal pads by a plurality of metal leads, respectively.

### Claim 6 (depends on 5)

The reduced-height image-capturing module according to claim 5, wherein the carrier base includes a plurality of lower metal pads disposed on a lower surface of each extending plate body thereof, and the circuit substrate includes a plurality of upper metal pads disposed on the upper surface thereof and around the through opening, and the lower metal pads are electrically connected to the upper metal pads through a plurality of conductive materials, respectively.

### Claim 7 (depends on 6)

The reduced-height image-capturing module according to claim 6, wherein the recessed metal pads are electrically connected to the lower metal pads through a plurality of conductive lines of the carrier base, respectively.

### Claim 8 (depends on 1)

The reduced-height image-capturing module according to claim 1, wherein the recessed bottom surface of the base groove is lower than a lower surface of the circuit substrate.