# US 12,604,530 B2 · Display device and method for manufacturing the same

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- Number: US 12,604,530 B2
- Document ID: US12604530B2
- Status: Granted
- Kind: B2
- Application number: 18/471,880
- Filed: 2023-09-21
- Published: 2024-04-18
- Granted: 2026-04-14
- Earliest claimed: 2022-10-17
- Assignees: LG Display Co., Ltd.
- Applicants: LG Display Co., Ltd.
- Inventors: Da-Young Kim; Won-Gyu Jeong; Joong-Ha Lee
- Web page: https://patentgrep.com/patent/US12604530B2

## CPC

- H10D 86/60: wherein the TFTs are in active matrices
- H10D 86/021: {of multiple TFTs}
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Disclosed is a display device including: a first substrate on which a plurality of micro-LEDs are disposed; a second substrate bonded to one surface of the first substrate; a side wiring electrically connecting the first substrate and the second substrate to each other; a side surface sealing member covering the side wiring; and an antistatic film covering an outer surface of the side surface sealing member, wherein the side surface sealing member includes an organic filler and core-shell particles dispersed in the organic filler.

## Claims

### Claim 1

A display device comprising:
a first substrate on which a plurality of micro-LEDs are disposed;
a second substrate bonded to a first surface of the first substrate;
a side wiring electrically connecting the first substrate and the second substrate to each other;
a side surface sealing member on the side wiring; and
an antistatic film on an outer surface of the side surface sealing member,
wherein the side surface sealing member includes an organic filler and core-shell particles dispersed in the organic filler.

### Claim 2 (depends on 1)

The display device of claim 1, wherein the first substrate includes a first pad disposed on an outermost position of the first substrate,
wherein the second substrate includes a second pad disposed on an outermost position of the second substrate, and
wherein the side wiring overlaps each of the first pad and the second pad.

### Claim 3 (depends on 1)

The display device of claim 1, further comprising a wiring protective film disposed between the side wiring and the side surface sealing member, the wiring protective film covering the side wiring.

### Claim 4 (depends on 1)

The display device of claim 1, further comprising a cover member disposed on the side surface sealing member and a portion of the first substrate,
wherein an outermost side surface of the antistatic film is substantially aligned with an outermost side surface of the cover member.

### Claim 5 (depends on 1)

The display device of claim 1, wherein the side surface sealing member overlaps a portion of a surface of the second substrate, and
wherein the antistatic film extends along a profile of the side surface sealing member.

### Claim 6 (depends on 1)

The display device of claim 1, wherein the core-shell particles include a plurality of first core-shell particles and a plurality of second core-shell particles dispersed in the organic filler,
wherein each of the plurality of first core-shell particles has a first size and each of the plurality of second core-shell particles has a second size larger than the first size.

### Claim 7 (depends on 6)

The display device of claim 6, wherein each of the plurality of first core-shell particles includes a first core including a first metal powder and a first shell surrounding the first core,
wherein each of the plurality of second core-shell particles includes a second core including a second metal powder and a second shell surrounding the second core, and
wherein one or more of the first shell or the second shell include an organic material, and one or more of the first metal powder or the second metal powder include silver (Ag) or copper (Cu).

### Claim 8 (depends on 6)

The display device of claim 6, wherein the first size of the first core-shell particle is smaller than 300 nanometers (nm),
wherein the second size of the second core-shell particle is larger than 1 micrometer (μm).

### Claim 9 (depends on 6)

The display device of claim 6, wherein a content in weight of the core-shell particles including the plurality of first core-shell particles and the plurality of second core-shell particles dispersed in the organic filler is in a range from 30% to 50%, inclusive.

### Claim 10 (depends on 6)

The display device of claim 6, wherein a ratio between a content in weight of the plurality of first core-shell particles and a content in weight of the plurality of second core-shell particles in the organic filler is in a range from 2:6 to 4:8, inclusive.

### Claim 11 (depends on 1)

The display device of claim 1, wherein the antistatic film has a surface resistance in a range from 100 to 103Ω/□, inclusive.

### Claim 12

A method for manufacturing a display device, the method comprising:
bonding a second substrate to a first surface of a first substrate, wherein a plurality of micro-LEDs are disposed on a second surface of the first substrate that is opposite to the first surface of the first substrate;
forming a side wiring disposed on a side surface of each of the first substrate and the second substrate, the side wiring electrically connecting the first substrate and the second substrate to each other;
forming a side surface sealing member covering the side wiring, wherein the side surface sealing member includes an organic filler and core-shell particles dispersed in the organic filler; and
forming an antistatic film by cutting the side surface sealing member using a laser beam.

### Claim 13 (depends on 12)

The method of claim 12, wherein the antistatic film is formed by repeatedly irradiating the laser beam onto the side surface sealing member to sinter a portion of the core-shell particles.

### Claim 14 (depends on 13)

The method of claim 13, wherein the antistatic film formed by sintering the core-shell particles has a surface resistance in a range from 100 to 103Ω/□, inclusive.

### Claim 15 (depends on 12)

The method of claim 12, wherein the core-shell particles include a plurality of first core-shell particles and a plurality of second core-shell particles dispersed in the organic filler,
wherein each of the plurality of first core-shell particles has a first size and each of the plurality of second core-shell particles has a second size larger than the first size.

### Claim 16 (depends on 15)

The method of claim 15, wherein each of the plurality of first core-shell particles includes a first core including a first metal powder and a first shell surrounding the first core,
wherein each of the plurality of second core-shell particles includes a second core including a second metal powder and a second shell surrounding the second core,
wherein one or more of the first shell or the second shell include an organic material, and one or more of the first metal powder or the second metal powder include silver (Ag) or copper (Cu).

### Claim 17 (depends on 15)

The method of claim 15, wherein a content in weight of the core-shell particles including the plurality of first core-shell particles and the plurality of second core-shell particles dispersed in the organic filler is in a range from 30% to 50%, inclusive.

### Claim 18 (depends on 15)

The method of claim 15, wherein a ratio of a content in weight of the plurality of first core-shell particles and a content in weight of the plurality of second core-shell particles is in a range from 2:6 to 4:8, inclusive.

### Claim 19 (depends on 12)

The method of claim 12, further comprising, after forming the side wiring and before forming the side surface sealing member, forming a wiring protective film covering the side wiring, the wiring protective film including black ink.

### Claim 20

A display device comprising:
a first substrate;
a second substrate bonded to the first substrate;
a side wiring extending along side surfaces of the first substrate and the second;
a side surface sealing member on the side wiring, the side surface sealing member including an organic filler and core-shell particles of different sizes dispersed in the organic filler, the core-shell particles including metal powders; and
an antistatic film on an outer surface of the side surface sealing member, the antistatic film including metal in a sintered state that is the same metal as those in the side surface sealing member.
